Polishing device, surface modification device and polishing method

Abstract

The disclosure provides an apparatus and method for polishing a semiconductor substrate in the manufacture of semiconductor devices, ie, a polishing apparatus, a surface modification apparatus, and a polishing method. The apparatus may include: a carrier configured to support the substrate; a polishing pad configured to polish the first surface of the substrate; a chemical mechanical polishing slurry delivery arm configured to distribute the chemical mechanical polishing slurry onto the first surface of the substrate; the pad Conditioner, configured to condition the polishing pad. In some embodiments, the pad conditioner may include: a conditioning disc configured to scrape the polishing pad; a conditioning arm configured to rotate the conditioning disc; a plurality of magnetic screws configured to secure the conditioning disc to the conditioning arm and including corresponding a plurality of screw heads; a plurality of blocking devices are respectively located under the plurality of screw heads, and are configured to prevent debris particles from entering the corresponding plurality of screw holes.

Description

technical field [0001] The present disclosure relates to apparatus and methods for polishing semiconductor substrates. Background technique [0002] The semiconductor integrated circuit (integrated circuit, IC) industry has experienced rapid growth. Technological advances in integrated circuit materials and design have produced several generations of integrated circuits, each with smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing integrated circuits, and similar developments in integrated circuit processing and manufacturing are required to realize these advances. During the evolution of integrated circuits, functional density (ie, the number of interconnected devices per die area) has generally increased while geometry size (ie, the smallest component (or line width) that can be produced using a fabrication process) has decreased. This scaling down process often provides be...

AI Technical Summary

Problems solved by technology

However, these advances have increased the complexity of processing and manufacturing integrated circuits, and in order to achieve these advances, similar developments in integrated circuit processing and fabrication are required

Images