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Fingerprint recognition module and electronic equipment

A technology for fingerprint identification modules and electronic equipment, which is applied in character and pattern recognition, circuits, electrical components, etc., and can solve the problems of large thickness and thickness of fingerprint identification modules, and achieve the effect of reducing thickness and improving recognition accuracy

Pending Publication Date: 2020-02-11
昆山丘钛生物识别科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The frame-shaped support 104 is made of plastic material and has a relatively large thickness, resulting in a relatively large thickness of the fingerprint recognition module

Method used

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  • Fingerprint recognition module and electronic equipment
  • Fingerprint recognition module and electronic equipment
  • Fingerprint recognition module and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0027] Please refer to figure 2 and image 3 , the fingerprint recognition module provided in the first embodiment of the present invention includes a substrate 11 , a circuit board 12 , an optical fingerprint chip 14 and a cover plate 15 . The substrate 11 is a hard board, the circuit board 12 and the optical fingerprint chip 14 are both arranged on the substrate 11, the circuit board 12 is provided with a slot 122, the optical fingerprint chip 14 is accommodated in the slot 122, and the optical fingerprint chip 14 is electrically connected on the circuit board 12. The cover plate 15 is fixed on the side of the circuit board 12 away from the base plate 11, and the cover plate 15 is arranged around the optical fingerprint chip 14, and the cover plate 15 is a black cover plate.

[0028] In this embodiment, the substrate 11 is a steel plate, such as a reinforced steel plate. More specifically, the base plate 11 is a stainless steel reinforcing plate. The combination of the ...

no. 2 example

[0039] The structure of the fingerprint identification module of the second embodiment of the present invention is basically the same as that of the first embodiment, the difference is that in the second embodiment, as Figure 4 As shown, the cover plate 15 includes a first prepreg 152 and a black cover film 154 , and the black cover film 154 is bonded to the first prepreg 152 by an adhesive, thereby forming the black cover plate 15 . The first prepreg 152 is viscous and can be activated and cured when heated, so as to bond the cover plate 15 to the circuit board 12 .

[0040] In this embodiment, the black covering film 154 is matte black because it can better eliminate stray light in the fingerprint identification module.

[0041] Other structures of this embodiment are the same as those of the first embodiment, and will not be repeated here.

no. 3 example

[0043] The structure of the fingerprint recognition module of the third embodiment of the present invention is basically the same as that of the first embodiment, the difference is that in the third embodiment, as Figure 5As shown, the substrate 11 is a single-sided hard board. Since the substrate 11 is a single-sided hard board, after it is combined with the circuit board 12 made of a single panel, double-sided wiring can be realized, so via holes can be made on the upper and lower sides of the substrate 11 and the circuit board 12 to realize double-sided wiring. The length and width dimensions of the fingerprint identification module can be reduced, making the fingerprint identification module more miniaturized.

[0044] In addition, the fingerprint identification module does not include the first glue 16 , but a second prepreg 21 is arranged between the substrate 11 and the circuit board 12 , and the circuit board 12 is fixed on the substrate 11 through the second prepreg ...

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PUM

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Abstract

The invention discloses a fingerprint recognition module and electronic equipment. The fingerprint recognition module comprises a substrate, a circuit board, an optical fingerprint chip and a cover plate, wherein the circuit board and the optical fingerprint chip are both arranged on the substrate, the circuit board is provided with an open groove, the optical fingerprint chip is accommodated in the open groove, the optical fingerprint chip is electrically connected to the circuit board, the cover plate is fixed on one side, far away from the substrate, of the circuit board, the cover plate isarranged around the optical fingerprint chip, and the cover plate is a black cover plate. According to the fingerprint recognition module and the electronic equipment provided by the invention, the cover plate is fixedly connected to the circuit board, so that a plastic bracket does not need to be formed by means of injection molding and the like, and the cover plate can have a relatively small thickness; moreover, the black cover plate can absorb stray light around the optical fingerprint chip to prevent diffuse reflection, thereby improving the recognition precision. Meanwhile, the opticalfingerprint chip is located in the open groove of the circuit board and is lower than the top surface of the circuit board, so that the thickness of the fingerprint recognition module can be reduced.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a fingerprint identification module and electronic equipment. Background technique [0002] With the rapid development of the electronics industry, fingerprint recognition technology is widely used. Not only can fingerprint recognition technology be seen in access control and attendance systems, but there are more fingerprint recognition applications on the market: such as laptops, mobile phones, cars , bank payment, etc. In electronic products such as mobile phones, the fingerprint recognition module and the display screen are usually designed in layers, which can increase the screen ratio of the display area of ​​the mobile phone and meet the increasing needs of people. The fingerprint recognition technology is replaced by the traditional capacitive fingerprint recognition Converted to under-screen fingerprint recognition. [0003] At present, the fingerprint rec...

Claims

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Application Information

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IPC IPC(8): G06K9/00
CPCG06V40/1324H01L2224/48091H01L2924/00014
Inventor 高涛涛
Owner 昆山丘钛生物识别科技有限公司