Calibration method of manipulator, calibration device, and semiconductor processing equipment

Abstract

The invention discloses a calibration method and device of a manipulator and semiconductor processing equipment. Including controlling the manipulator to enter the rough pick-up position to take the test wafer, and recording the rough telescopic radius and rough rotation angle of the manipulator at the rough pick-up position; controlling the manipulator to place the test wafer on the linear calibrator for calibration, and obtaining the test wafer The offset of the center of the circle and the offset of the rotation angle; according to the rough telescopic radius, the rough rotation angle, the offset of the center of the circle and the offset of the rotation angle, determine the precise film-taking position of the manipulator. It can automatically and quickly find the rough film taking position, and can automatically and quickly determine the precise film taking position of the manipulator at each process position, so as to avoid process position errors caused by human factors and facilitate later equipment maintenance.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a calibration method of a manipulator, a calibration device of a manipulator and a semiconductor processing equipment. Background technique [0002] In semiconductor processing equipment, robots are generally used to transfer wafers. After the equipment is assembled or when the equipment is regularly overhauled and maintained, the engineer needs to overhaul the manipulator and calibrate the transfer station to ensure that the wafer can be accurately dropped directly above the electrostatic chuck in the process chamber. If the center of the wafer is shifted relative to the center of the electrostatic chuck, the wafer will not be electrostatically adsorbed for subsequent processes, and the wafer and the manipulator are prone to collision and friction during the wafer transfer process, resulting in a large amount of particulate matter contaminating the wafer and the ...

AI Technical Summary

Problems solved by technology

However, due to the narrow space and dark light inside the process chamber, different operators have different observation angles and methods, resulting in the positioning of the manipulator requiring repeated operations many times, and the calibration accuracy is low, and the direction of the manipulator cannot be calibrated, resulting in potential failures

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