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LED lamp bead production equipment

A technology of LED lamp beads and production equipment, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc. It can solve the problems that the height and angle of glue filling cannot be controlled, and achieve the effect of avoiding excessive rotation angle

Inactive Publication Date: 2020-02-14
SHENZHEN LT OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, when pouring glue, it is impossible to adjust the height and angle of glue pouring at any time to ensure the chromaticity value of LED lamp beads

Method used

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  • LED lamp bead production equipment
  • LED lamp bead production equipment
  • LED lamp bead production equipment

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Embodiment Construction

[0047] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.

[0048] See figure 1 , LED lamp bead automatic production equipment 1 is used to produce LED chips a and LED bracket M into LED lamp beads, which includes chip discharging equipment 10, crystal bonding equipment 20, wire bonding equipment 30 and glue filling equipment 40. The chip arrangement device 10 loads the LED bracket M, that is, separates the LED bracket M from the dust-free paper, and packs the LED bracket M. The die bonding device 20 fixes the LED chip a on the LED bracket, and the wire bonding device 30 solders the wires of the LED chip a and the LED bracket M together. Fi...

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PUM

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Abstract

The invention provides LED lamp bead production equipment, which is used for producing LED lamp beads and comprises chip arranging equipment, die bonding equipment, wire welding equipment and glue pouring equipment, wherein the chip arranging equipment provides an LED support, the die bonding equipment provides an LED chip and fixes the LED chip on the LED support, and the wire welding equipment enables the LED chip and the LED support to be electrically connected through a wire by means of welding. The glue pouring equipment comprises a glue feeding mechanism and a glue pouring mechanism, wherein the glue feeding mechanism comprises a feeding frame and a movable support, and the movable support can move relative to the feeding frame; the glue pouring mechanism comprises a support, a gluepouring assembly and an adjusting assembly, the support is slidably connected with the movable support, the glue pouring assembly is rotatably connected with the support, and the adjusting assembly isconnected with the support; and the adjusting assembly can drive the glue pouring assembly to rotate relative to the support so as to adjust the glue pouring angle of the glue pouring mechanism. Meanwhile, the adjusting assembly can also move in the direction perpendicular to the ground relative to the movable support so as to adjust the height of the glue pouring mechanism relative to the feeding frame.

Description

【Technical Field】 [0001] The invention relates to the field of LED production, in particular to an LED lamp bead production equipment. 【Background technique】 [0002] In the production process of LED lamp beads, multiple LED chips are usually arranged on the LED bracket to achieve batch operation, and the LED bracket is usually placed on top of each other. The LED chip on the LED bracket is fixed through the die bonding process, the LED bracket is electrically connected to the LED chip through the wire bonding process, and then the color of the LED chip emitting light source is changed through glue filling to make the LED lamp bead. [0003] The LED feeding operation described in the prior art usually takes a piece of LED bracket, puts it into the material box, then removes a piece of dust-free paper, then takes a piece of LED bracket into the material box, and then removes a piece of dust-free paper. The operation is repeated until the material box is full, and the positions of t...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67126H01L21/67144
Inventor 陈彦铭
Owner SHENZHEN LT OPTOELECTRONICS CO LTD