Resin molded sheet and method for producing same, molded article and method for producing same
A technology for resin forming and manufacturing methods, used in chemical instruments and methods, synthetic resin layered products, coatings, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment approach 1
[0027] (resin molded sheet 10)
[0028] Such as figure 1 As shown, the resin molded sheet 10 has a base material 11, and is provided on a first surface of the base material 11 ( figure 1 The first heat-expandable layer 12 on the upper surface shown), and the second surface (the surface opposite to the first surface) that is arranged on the base material 11, figure 1 The second thermal expansion layer 13 on the lower surface shown). As will be described later in detail, in the molded resin sheet 10, the force of expansion of the first thermal expansion layer 12 and the second thermal expansion layer 13 deforms the base material 11, and the base material 11 maintains the deformed shape. Thereby, the base material 11 of the resin molded sheet 10 is molded into a desired shape, and the molded object 41 is produced.
[0029] The substrate 11 supports the first thermal expansion layer 12 and the second thermal expansion layer 13 . The base material 11 is a sheet-like member made...
Embodiment approach 2
[0072] Hereinafter, the resin molded sheet, the manufacturing method of the resin molded sheet, the molded object, and the manufacturing method of the molded object according to Embodiment 2 will be described with reference to the drawings. The difference between the resin molded sheet 20 of this embodiment and the resin molded sheet 10 of Embodiment 1 is that a first intermediate layer 21 is provided between the base material 11 and the first thermal expansion layer 12, and a first intermediate layer 21 is provided between the base material 11 and the second thermal expansion layer. The second intermediate layer 22 is provided between the thermal expansion layers 13 . The same reference numerals are assigned to the same features as those in Embodiment 1, and detailed description thereof will be omitted.
[0073] (resin molded sheet 20)
[0074] Such as Figure 7 As shown, the resin molded sheet 20 includes a base material 11 , a first intermediate layer 21 , a first thermal...
Embodiment approach 3
[0107] Next, use Figure 12A as well as Figure 12B The resin molded sheet 30 of Embodiment 3 will be described. In this embodiment, a heat conversion material is mixed in the heat expansion layer. Detailed descriptions of parts that overlap with the above-mentioned embodiments are omitted.
[0108] (resin molded sheet 30)
[0109] Such as Figure 12A As shown, the resin molded sheet 30 includes a base material 11 , a first thermally expandable layer 31 , and a second thermally expandable layer 32 . The base material 11 is the same as that of the first embodiment.
[0110] The first heat-expandable layer 31 is a layer that expands to a size corresponding to the degree of heating, as in Embodiment 1, and a heat-expandable material is dispersed in a binder. The materials of the thermally expandable material and the binder are the same as those in Embodiment 1. The present embodiment is characterized in that it contains a heat conversion material in addition to the binder ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


