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Resin molded sheet and method for producing same, molded article and method for producing same

A technology for resin forming and manufacturing methods, used in chemical instruments and methods, synthetic resin layered products, coatings, etc.

Active Publication Date: 2022-05-13
CASIO COMPUTER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the cost and time required to manufacture the mold

Method used

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  • Resin molded sheet and method for producing same, molded article and method for producing same
  • Resin molded sheet and method for producing same, molded article and method for producing same
  • Resin molded sheet and method for producing same, molded article and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0027] (resin molded sheet 10)

[0028] Such as figure 1 As shown, the resin molded sheet 10 has a base material 11, and is provided on a first surface of the base material 11 ( figure 1 The first heat-expandable layer 12 on the upper surface shown), and the second surface (the surface opposite to the first surface) that is arranged on the base material 11, figure 1 The second thermal expansion layer 13 on the lower surface shown). As will be described later in detail, in the molded resin sheet 10, the force of expansion of the first thermal expansion layer 12 and the second thermal expansion layer 13 deforms the base material 11, and the base material 11 maintains the deformed shape. Thereby, the base material 11 of the resin molded sheet 10 is molded into a desired shape, and the molded object 41 is produced.

[0029] The substrate 11 supports the first thermal expansion layer 12 and the second thermal expansion layer 13 . The base material 11 is a sheet-like member made...

Embodiment approach 2

[0072] Hereinafter, the resin molded sheet, the manufacturing method of the resin molded sheet, the molded object, and the manufacturing method of the molded object according to Embodiment 2 will be described with reference to the drawings. The difference between the resin molded sheet 20 of this embodiment and the resin molded sheet 10 of Embodiment 1 is that a first intermediate layer 21 is provided between the base material 11 and the first thermal expansion layer 12, and a first intermediate layer 21 is provided between the base material 11 and the second thermal expansion layer. The second intermediate layer 22 is provided between the thermal expansion layers 13 . The same reference numerals are assigned to the same features as those in Embodiment 1, and detailed description thereof will be omitted.

[0073] (resin molded sheet 20)

[0074] Such as Figure 7 As shown, the resin molded sheet 20 includes a base material 11 , a first intermediate layer 21 , a first thermal...

Embodiment approach 3

[0107] Next, use Figure 12A as well as Figure 12B The resin molded sheet 30 of Embodiment 3 will be described. In this embodiment, a heat conversion material is mixed in the heat expansion layer. Detailed descriptions of parts that overlap with the above-mentioned embodiments are omitted.

[0108] (resin molded sheet 30)

[0109] Such as Figure 12A As shown, the resin molded sheet 30 includes a base material 11 , a first thermally expandable layer 31 , and a second thermally expandable layer 32 . The base material 11 is the same as that of the first embodiment.

[0110] The first heat-expandable layer 31 is a layer that expands to a size corresponding to the degree of heating, as in Embodiment 1, and a heat-expandable material is dispersed in a binder. The materials of the thermally expandable material and the binder are the same as those in Embodiment 1. The present embodiment is characterized in that it contains a heat conversion material in addition to the binder ...

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Abstract

A resin molded sheet, a method for manufacturing the resin molded sheet, a molded object, and a method for manufacturing the molded object. The resin molded sheet has: a base material made of resin; a first thermal expansion layer comprising a thermal expansion material and disposed on the first surface of the base material; and a second thermal expansion layer comprising a thermal expansion material and disposed on the first surface of the base material. On the second surface of the substrate, the first thermal expansion layer is disposed on the first surface of the substrate at least in the first region where the substrate is deformed by the first thermal expansion layer, and the second The thermal expansion layer is disposed on the second surface of the substrate at least in the second area where the substrate is deformed by the second thermal expansion layer.

Description

technical field [0001] The present invention relates to a resin molded sheet using a thermally expandable layer containing a thermally expandable material that expands according to absorbed heat, a method for producing the resin molded sheet, and a molded object using the resin molded sheet and a method for manufacturing the molded object . Background technique [0002] Conventionally, switches such as membrane switches have been used as digital and other input units of electronic equipment. In the membrane switch, for example, an embossed resin sheet is used. In addition, in embossing, forming into a desired shape is performed using a concave die and a convex die (for example, JP-A-6-8254). [0003] In such a method, before molding the resin sheet, it is necessary to prepare a mold corresponding to the shape to be processed. Therefore, there is a problem that it requires cost and time to manufacture a mold. [0004] Especially in the manufacturing stage of a prototype, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C44/34B29C44/12B29C35/08
CPCB29C44/3415B29C44/12B29C35/0805B29C2035/0822B29K2067/003B29C35/0266B29C44/022B29K2105/048B32B7/06B32B2307/414B32B27/302B32B2255/20B32B27/40B32B2250/24B32B2307/51B32B2307/75B32B27/304B32B2255/28B32B27/08B32B1/00B32B27/36B32B2307/4026B32B2307/732B32B27/34B32B2255/26B32B27/306B32B2255/10B32B27/281B32B2307/748B32B7/12B32B27/308B32B27/32B32B2307/20B32B3/263B32B2250/03B32B2307/412B32B7/027B32B5/18B32B27/065
Inventor 高桥秀树
Owner CASIO COMPUTER CO LTD