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Light emitting device and manufacturing method thereof

Inactive Publication Date: 2020-02-25
INNOVATION & TRANSFORMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, limited by the limitations of the existing technology, it is necessary to coat the luminescent material on the substrate through a mask to achieve pixel resolution, and the critical dimension of the mask is usually not less than 100 microns
Therefore, it is quite difficult for OLED manufacturers to manufacture products with a pixel density of 800ppi or more

Method used

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  • Light emitting device and manufacturing method thereof
  • Light emitting device and manufacturing method thereof
  • Light emitting device and manufacturing method thereof

Examples

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Embodiment Construction

[0010] The following disclosure provides many different embodiments, or examples, for implementing the various features of the application. Specific examples of components and configurations are described below to simplify the disclosure of the present application. Of course, these are examples only and are not intended to limit the application. For example, the following description of forming a first feature on or over a second feature may include embodiments in which first and second features are formed in direct contact, and may also include embodiments in which other features are formed between the first and second features. , so the first and second features are not in direct contact. Additionally, the application may repeat element symbols and / or letters in different instances. This repetition is for simplicity and clarity and does not dictate the relationship between the different embodiments and / or architectures discussed.

[0011] Furthermore, the application can ...

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Abstract

The present disclosure provides a light emitting device. The light emitting device includes a substrate, an array of light emitting units over the substrate, and an array of bumps. Each of the bumps is disposed between two of the light emitting units. Each of the light emitting units includes a first electrode including a bottom surface on the substrate, a top surface opposite to the bottom surface, and a sidewall between the bottom surface and the top surface. Each of the light emitting units includes a first organic layer on the first electrode and a second organic layer on the first organiclayer. The first organic layer at least partially covers the sidewall. A method for manufacturing a light emitting device is also provided.

Description

technical field [0001] (Priority Claims and Cross-References) [0002] This disclosure claims priority to earlier filed U.S. Provisional Application No. 62 / 719,039, filed August 16, 2018, and to earlier filed U.S. Patent Application No. 16 / 232,944, filed for December 26, 2018. [0003] The present disclosure relates to a light-emitting device, and more particularly to an organic light-emitting device and a manufacturing method thereof. Background technique [0004] Organic light emitting displays (OLEDs) have been widely used in many high-end electronic devices. However, due to limitations of the prior art, it is necessary to coat the luminescent material on the substrate through a mask to achieve pixel resolution, and the critical dimension of the mask is generally not less than 100 microns. Therefore, it is quite difficult for OLED manufacturers to manufacture products with a pixel density of 800ppi or more. Contents of the invention [0005] In the present disclosur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L51/56H10K99/00
CPCH10K59/122H10K59/1201H10K59/131H10K59/35H10K50/171H10K50/15H10K50/16G06F3/013G09G3/2074G09G2340/0407G09G2354/00H04N23/00H10K50/11H10K50/844H10K71/00H10K71/233
Inventor 黄丰裕陈慧修陈政欣
Owner INNOVATION & TRANSFORMATION