Heat dissipation unit and heat dissipation device thereof

Abstract

The invention provides a heat dissipation unit and a heat dissipation device thereof. The heat dissipation device comprises a base and the radiating unit, the base is provided with a first side and asecond side, and the heat dissipation unit is provided with at least one heat dissipation fin correspondingly arranged at the first side. The heat dissipation fin is formed by correspondingly coveringa first plate body and a second plate body, the first plate body and the second plate body jointly define a plurality of independent flow channels, and the independent flow channels are communicatedwith each other and are filled with the working fluid.

Description

technical field [0001] The present invention relates to a heat dissipation unit and a heat dissipation device thereof, in particular to a heat dissipation unit and a heat dissipation device thereof which greatly increase the heat dissipation efficiency. Background technique [0002] The current mobile devices, personal computers, servers, communication boxes or other systems or devices have improved computing performance, and the heat generated by their internal computing units has also increased, so relatively more heat dissipation units are needed to assist their heat dissipation. Most manufacturers use heat dissipation components such as radiators, heat pipes, and vapor chambers with fans for auxiliary heat dissipation, and when large areas are required for heat dissipation, they use heat dissipation devices (radiators) and cooling fans for forced heat dissipation. [0003] Generally, common heat dissipation devices (heat sinks) in the industry are composed of a substrate...

AI Technical Summary

Problems solved by technology

[0005] 1. Extremely poor cooling efficiency;

[0006] 2. The cooling device is too large

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