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Method for applying die-cuts to surfaces and testing methods therefor

A technology of die-cutting, die-cutting, applied in the direction of bonding methods, household components, applications, etc.

Active Publication Date: 2022-05-03
TESA SE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] A problem that often arises with regard to the manufacture of motor vehicles is that, after work procedures have already been carried out, openings made in body parts have to be glued closed again

Method used

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  • Method for applying die-cuts to surfaces and testing methods therefor
  • Method for applying die-cuts to surfaces and testing methods therefor
  • Method for applying die-cuts to surfaces and testing methods therefor

Examples

Experimental program
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Embodiment Construction

[0029] In a preferred embodiment of the method, the applicator comprises:

[0030] (i) a punching machine having a punch,

[0031] and

[0032] (iii) pad take-up rolls,

[0033] Wherein, in this method, the die-cutting belt runs on the punch of the punching machine, when one of the die-cut parts is on the punching head, the die-cutting belt is stopped, and then the punching machine sticks the die-cutting parts in an up and down motion. attached to the surface.

[0034] If the ratio of the pull-off force of the die-cut from the backing layer in z-direction to the pull-off force of the die-cut from said surface in z-direction is at most 0.15, preferably at most 0.12 and more particularly at most 0.10, then is particularly beneficial.

[0035] The method of the invention is suitable for both manual and automated application of die-cuts. In the particular case of automated application, the method according to the invention brings with it great advantages, since here special e...

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Abstract

The invention relates to a method for transferring die-cuts from a backing layer to a surface, the die-cuts being transferred from the backing layer to the surface by means of an applicator, characterized in that the die-cuts move from the backing layer in the z-direction The ratio of the pull-off force to the pull-off force of the die-cut from said surface in the z-direction is at most 0.18. This method enables a particularly reliable and secure transfer of the die-cut parts from the die-cut tape to the surface to be bonded. As a result, the frequency of errors in the bonding of plastic parts can be reduced accordingly.

Description

technical field [0001] The invention relates to a method for transferring die-cuts, ie die-cut parts, from a backing layer to a surface, the die-cuts being transferred from the backing layer to the surface by means of an applicator, characterized in that the die-cuts move from the backing layer to the surface in the z-direction The ratio of the pull-off force of the mat to the pull-off force (separation force) of the die-cut from said surface in the z-direction is at most 0.18. The invention further relates to a test method for selecting an adhesive tape as a die-cut tape to transfer a die-cut piece from a backing layer to the surface of a substrate (substrate) by means of an applicator, the die-cut tape being formed by a die applied on the backing layer. A die cut is formed comprising at least one adhesive composition (ingredient) layer. Background technique [0002] Adhesives and tapes are commonly used to assemble two substrates to form a durable or permanent bond. Desp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65C9/18B65H35/07C09J153/02C09J133/04
CPCB65C9/1865B65C9/1803B65H35/0033C09J153/02C09J133/04B65H35/0013C09J5/00B65H2301/51538B65H2301/4493B65H2701/192B29C65/52B29C65/5078B29C65/82B29C65/7835B29C66/9221B29C65/5092B29C65/56C09J7/385C09J2301/124C09J2301/416C09J2453/00C09J2301/312C09J7/387C09J7/26B29C65/5057B29C66/863B29C66/9241B29L2031/30C09J11/08C09J2400/243C09J2421/00C09J2433/006G01L5/0033C09J2301/408C09J2301/412C09J2301/414
Inventor J.塞林A.巴克利H-P.布兰特M.科拉佐
Owner TESA SE
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