Method for applying diecuts to surfaces and also test method therefor

A test method, technology for die-cutting parts, used in household components, bonding methods, applications, etc.

Active Publication Date: 2020-03-17
TESA SE
View PDF17 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] A problem that often arises with regard to the manufacture of motor vehicles is that, after...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for applying diecuts to surfaces and also test method therefor
  • Method for applying diecuts to surfaces and also test method therefor
  • Method for applying diecuts to surfaces and also test method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In a preferred embodiment of the method, the applicator comprises:

[0030] (i) a punching machine having a punch,

[0031] and

[0032] (iii) pad take-up rolls,

[0033] Wherein, in this method, the die-cutting belt runs on the punch of the punching machine, when one of the die-cut parts is on the punching head, the die-cutting belt is stopped, and then the punching machine sticks the die-cutting parts in an up and down motion. attached to the surface.

[0034] If the ratio of the pull-off force of the die-cut from the backing layer in z-direction to the pull-off force of the die-cut from said surface in z-direction is at most 0.15, preferably at most 0.12 and more particularly at most 0.10, then is particularly beneficial.

[0035] The method of the invention is suitable for both manual and automated application of die-cuts. In the particular case of automated application, the method according to the invention entails great advantages, since here special emphasis...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to view more

Abstract

Systems and methods transfer diecuts from a liner layer to a surface. One method may transfer a diecut from the liner layer to the surface by means of an applicator, wherein a ratio of the pull-off force of the diecut from the liner layer in the z direction to the pull-off force of the diecut from the surface in the z direction is at most 0.18. The method may enable particularly reliable and firmtransfer of the diecut from a diecut tape to a surface where bonding is to take place. As a result, it may be possible for the frequency of errors in the bonding of plastics parts to be relevantly reduced.

Description

technical field [0001] The invention relates to a method for transferring die-cuts, ie die-cut parts, from a backing layer to a surface, the die-cuts being transferred from the backing layer to the surface by means of an applicator, characterized in that the die-cuts move from the backing layer to the surface in the z-direction The ratio of the pull-off force of the mat to the pull-off force (separation force) of the die-cut from said surface in the z-direction is at most 0.18. The invention further relates to a test method for selecting an adhesive tape as a die-cut tape to transfer a die-cut piece from a backing layer to the surface of a substrate (substrate) by means of an applicator, the die-cut tape being formed by a die applied on the backing layer. A die cut is formed comprising at least one adhesive composition (ingredient) layer. Background technique [0002] Adhesives and tapes are commonly used to assemble two substrates to form a durable or permanent bond. Desp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B65C9/18B65H35/07C09J153/02C09J133/04
CPCB65C9/1865B65C9/1803B65H35/0033C09J153/02C09J133/04B65H35/0013C09J5/00B65H2301/51538B65H2301/4493B65H2701/192B29C65/52B29C65/5078B29C65/82B29C65/7835B29C66/9221B29C65/5092B29C65/56C09J7/385C09J2301/124C09J2301/416C09J2453/00C09J2301/312C09J7/387C09J7/26B29C65/5057B29C66/863B29C66/9241B29L2031/30C09J11/08C09J2400/243C09J2421/00C09J2433/006G01L5/0033C09J2301/408C09J2301/412C09J2301/414
Inventor J.塞林A.巴克利H-P.布兰特M.科拉佐
Owner TESA SE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap