Machining and conveying device of flexible printed circuit

Abstract

The invention discloses a machining and conveying device of a flexible printed circuit, and relates to the technical field of circuit board machining. The machining and conveying device comprises a base frame, a conveying mechanism, a drilling mechanism, a dust collection mechanism and a cutting mechanism, wherein the base frame is provided with a detection mechanism used for detecting the numberof holes in the circuit board, the base frame is internally provided with a PLC, and the conveying mechanism is installed on the base frame through a first installation frame and a second installationframe. According to the device, the special conveying mechanism is arranged, a conventional conveying mode is changed, the flexible printed circuit can be fed in a stepping mode with the end face kept flat, the phenomenon that the board is warped and uneven is avoided, and therefore the drilling quality of the drilling procedure is guaranteed; and the drilling mechanism is arranged, a scheme of laser drilling from bottom to top is adopted, and the dust collection mechanism which is arranged above and matched with the output end of a cutting machine can directly suck and peel off drilling waste attached and bonded to the peripheries of the holes, so that manual peeling again is not needed.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a processing and conveying device for FPC flexible circuit boards. Background technique [0002] Flexible printed circuit board (FPC) is a printed circuit made of flexible insulating substrates, which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC can greatly reduce the volume and weight of electronic FPC. It is suitable for the development of electronic FPC in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripher...

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Problems solved by technology

[0003] At present, our company has found the following disadvantages during the long-term processing of flexible circuit boards: 1. In terms of transportation, it is often carried out according to the conventional transportation method of ordinary circuit boards. However, due to the flexible material of FPC, according to this The surface of the board will be warped and uneven in the way of conveying, especially in the opening section. Since the opening on the circuit board should be in the shape of a cone strictly speaking, once the end surface of the opening is uneven , the hole will be skewed, which will greatly affect the subsequent process processing, and even directly cause the processed parts to be unusable, and finally be scrapped; second, in the collection of hole waste, it is often through the gravity of the waste itself after the hole is opened. However, during the process, it was found that after the laser cutting machine acts on the circuit board, static electricity will be generated at the opening. The phenomenon of not falling, adsorption and adhesion around the opening, requires manual peeling, resulting in unnecessary waste of manpower, and if it is not found in time, it will still affect the subsequent processing procedures

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