A processing and conveying device for fpc flexible circuit boards

Abstract

The invention discloses a processing and conveying device for an FPC flexible circuit board, which relates to the technical field of circuit board processing, and includes a base frame, a conveying mechanism, a hole opening mechanism, a dust suction mechanism and a cutting mechanism, and a detection circuit is installed on the base frame As for the detection mechanism of the number of plate openings, a PLC controller is arranged inside the base frame, and the conveying mechanism is installed on the base frame through the first mounting frame and the second mounting frame. The present invention changes the conventional conveying method by setting a unique conveying mechanism, so that the flexible circuit board can keep the end surface flat for step-by-step feeding, and the phenomenon of board surface warping and unevenness will not occur, thereby ensuring the opening process of the opening process. Quality; by setting the hole opening mechanism and adopting the bottom-up laser hole opening scheme, and then by the dust suction mechanism set above and matched with the output end of the cutting machine, the adsorption can be adhered to the opening around the opening The waste material is directly absorbed and peeled off, no need to peel off manually again.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a processing and conveying device for FPC flexible circuit boards. Background technique [0002] Flexible printed circuit board (FPC) is a printed circuit made of flexible insulating substrates, which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC can greatly reduce the volume and weight of electronic FPC. It is suitable for the development of electronic FPC in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripher...

AI Technical Summary

Problems solved by technology

[0003] At present, our company has found the following disadvantages during the long-term processing of flexible circuit boards: 1. In terms of transportation, it is often carried out according to the conventional transportation method of ordinary circuit boards. However, due to the flexible material of FPC, according to this The surface of the board will be warped and uneven in the way of conveying, especially in the opening section. Since the opening on the circuit board should be in the shape of a cone strictly speaking, once the end surface of the opening is uneven , the hole will be skewed, which will greatly affect the subsequent process processing, and even directly cause the processed parts to be unusable, and finally be scrapped; second, in the collection of hole waste, it is often through the gravity of the waste itself after the hole is opened. However, during the process, it was found that after the laser cutting machine acts on the circuit board, static electricity will be generated at the opening. The phenomenon of not falling, adsorption and adhesion around the opening, requires manual peeling, resulting in unnecessary waste of manpower, and if it is not found in time, it will still affect the subsequent processing procedures

Images