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Fluid control device for substrate post-cleaning and fluid supply equipment for substrate post-cleaning

A fluid control device and post-cleaning technology, applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of unstable storage state, change, explosion, etc., achieve safe utilization and storage, and achieve redundant control. Effect

Pending Publication Date: 2020-04-10
TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] When using IPA equipment, it is necessary to add isopropanol liquid from the supply source to the IPA liquid storage tank. Because isopropanol is highly volatile and easy to vaporize, its storage state is unstable, and the air pressure in the tank is unstable or even changes drastically. There are potential safety hazards, and safety accidents such as explosions may also occur

Method used

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  • Fluid control device for substrate post-cleaning and fluid supply equipment for substrate post-cleaning
  • Fluid control device for substrate post-cleaning and fluid supply equipment for substrate post-cleaning

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Embodiment Construction

[0015] In order to enable those skilled in the art to better understand this solution, the technical solution in this solution embodiment will be clearly described below in conjunction with the accompanying drawings in this solution embodiment. Obviously, the described embodiment is a part of this solution Examples, but not all examples. Based on the embodiments in this solution, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of this solution.

[0016] The term "comprising" and any other variants in the description and claims of this solution and the above drawings mean "including but not limited to", and are intended to cover non-exclusive inclusion. In addition, the terms "first" and "second", etc. are used to distinguish different objects, not to describe a specific order.

[0017] The realization of the present invention is described in detail below in conjunction with specific accompa...

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Abstract

The invention discloses a fluid control device for substrate post-cleaning and fluid supply equipment for substrate post-cleaning. The equipment comprises a fluid storage container, an execution component used for controlling on-off of the pipeline of the fluid storage container, and a fluid control device connected with the execution component. The device comprises a first control part controlledby a main control module and a second control part controlled by a safety control module, the first control part and the second control part are connected in series to the execution part for controlling on-off of the pipeline of the fluid storage container; and when the main control module works abnormally, the safety control module controls the second control part to act to enable the executioncomponent to disconnect the pipeline of the fluid storage container.

Description

technical field [0001] The invention relates to the field of chemical mechanical polishing, in particular to a fluid control device and fluid supply equipment for post-cleaning of substrates. Background technique [0002] Chemical Mechanical Planarization (CMP) is an ultra-precision surface processing technology for global planarization in integrated circuit manufacturing. Since the chemical reagents and abrasives used in chemical mechanical polishing will cause contamination on the surface of the substrate, after polishing, a post-treatment process is required to remove the contaminants on the substrate surface. The post-treatment process generally consists of cleaning and drying to provide smoothness. Clean substrate surface. [0003] The purpose of cleaning after polishing is to remove particles and various chemical substances on the surface of the substrate, and to avoid corrosion and damage to the surface and internal structure during the cleaning process. Cleaning aft...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67034H01L21/6704
Inventor 郭振宇赵德文李长坤路新春
Owner TSINGHUA UNIV
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