Magnetic control type self-centering chip wafer robot complete machine

A self-centering, magnetically controlled technology, applied in semiconductor/solid-state device manufacturing, electrical components, workpiece clamping devices, etc., can solve problems such as wafer damage, to avoid wear and tear, clamping force balance, clamping more tightening effect

Inactive Publication Date: 2020-04-10
荆门欧曼凯机电设备有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0002] The invention patent with the patent number of 201210218852.9 proposes a wafer clamping device using spring clips, which has t

Method used

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  • Magnetic control type self-centering chip wafer robot complete machine
  • Magnetic control type self-centering chip wafer robot complete machine
  • Magnetic control type self-centering chip wafer robot complete machine

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[0022] The following describes the present invention in further detail with reference to the accompanying drawings and specific embodiments, without limiting the scope of implementation of the present invention.

[0023] Such as Figure 1 to Figure 7 As shown, the magnetron type self-centering chip wafer cleaning robot described in this embodiment includes a rotating circular table a1 on which a plurality of mechanical arms a2 are arranged around the center, and each mechanical arm The free end of a2 is equipped with a magnetic control fixture.

[0024] The magnetron clamp includes a base 1, three support pads 2, a floating shaft 3. The base 1 has an inner ring 11 and an outer ring 12 concentrically arranged, and the three support pads 2 are fixed on the base 1 The inner ring 11 is distributed in an equilateral triangle, the outer ring 12 of the base 1 is slidably connected with three clamping jaws 4, and the three clamping jaws 4 are distributed in an equilateral triangle, and th...

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Abstract

The invention discloses a magnetic control type self-centering chip wafer cleaning robot complete machine which comprises a grabbing disc with a vacuum suction cup, the grabbing disc is used for grabbing a wafer and placing the grabbed wafer on three supporting pads, an upper magnet is arranged in the middle of the grabbing disc, and the magnetism of the upper magnet is the same as that of the lower magnet; and the magnetic field force between the lower magnet and the upper magnet is used as a power source of centrifugal motion of the three clamping jaws, so that the edge of the wafer is not in contact with the clamping jaws and does not slide when the wafer is placed, and the wafer is prevented from being abraded and scratched.

Description

technical field [0001] The invention relates to a complete magnetically controlled self-centering chip wafer cleaning robot. Background technique [0002] The invention patent with the patent number of 201210218852.9 proposes a wafer clamping device using spring clips, which has the function of wafer clamping and positioning; Damage to the fragile wafer causes sliding friction between the wafer and the slider. Contents of the invention [0003] The object of the present invention is to overcome the above-mentioned shortcomings and provide a complete magnetically controlled self-centering chip wafer cleaning robot. [0004] To achieve the above object, the specific scheme of the present invention is as follows: [0005] A complete magnetically controlled self-centering chip wafer cleaning robot includes a rotating round table on which a plurality of robotic arms are arranged around the center, and a magnetically controlled clamp is arranged at the free end of each robotic...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/687B25B11/00
CPCB25B11/00H01L21/6838H01L21/68707
Inventor 李琳芳
Owner 荆门欧曼凯机电设备有限公司
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