A method for sound field equalization and an earphone

A headphone and equalization technology, which is applied in earpiece/headphone accessories, frequency/direction characteristic device, frequency response correction, etc., can solve the problem that the influence of the sound field cannot be offset

Active Publication Date: 2021-11-23
BESTECHNIC SHANGHAI CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the user actually wears the headset, due to the difference in the structure of the ear canal and the way it is worn, its impact on the sound field cannot be offset

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for sound field equalization and an earphone
  • A method for sound field equalization and an earphone
  • A method for sound field equalization and an earphone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] In order to enable those skilled in the art to better understand the technical solutions of the present disclosure, the present disclosure will be described in detail below in conjunction with the accompanying drawings and specific embodiments. Embodiments of the present disclosure will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, but are not intended to limit the present disclosure. For the various steps described herein, if there is no need for a contextual relationship between each other, the order described herein as an example should not be considered as a limitation, and those skilled in the art will know that the order can be adjusted, as long as It is enough not to destroy the logic between them so that the whole process cannot be realized.

[0025] Figure 1A A schematic diagram showing an audio signal received by a human ear according to an embodiment of the present disclosure. like Figure 1A As...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present disclosure relates to a method for sound field equalization and an earphone. The method includes: when the earphone is not placed in the ear canal, determining the first coefficient of the first filter, so that the first filter can simulate the signal distortion caused by the loudspeaker and the in-ear microphone used in the earphone; In the case of the ear canal, the second coefficient of the second filter is determined based on the first audio signal transmitted to the speaker, the second audio signal collected by the in-ear microphone, and the first coefficient of the first filter, so that The second filter can equalize signal distortion caused by ear canal reflection; process the first audio signal with the second filter of the second coefficient to obtain a third audio signal; and play the third audio signal. The above method balances the sound field changes caused by the structure of the human ear canal and the wearing method of the earphone by adjusting the filter coefficients, so as to ensure that the user can obtain high-quality listening experience in different wearing methods.

Description

technical field [0001] The present disclosure relates to a sound field equalization method for earphones, and more particularly, to a method for sound field equalization and an earphone. Background technique [0002] With the progress of society and the improvement of people's living standards, earphones have become an indispensable daily necessities for people; they can enable users to enjoy a comfortable listening experience in various noisy environments such as airports, subways, airplanes, and restaurants. In-ear earphones, especially semi-in-ear earphones, are more and more widely recognized by the market and customers because of their wearing comfort. However, different earphone wearing methods and the structure of the human ear canal greatly affect the sound field of the earphone, and also bring users an unsatisfactory listening experience. In addition, if the frequency response of the speaker is not flat enough, it will also affect the sound field. [0003] The exi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/10H04R1/20H04R3/04
CPCH04R1/10H04R1/20H04R3/04
Inventor 李倩
Owner BESTECHNIC SHANGHAI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products