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Resonator with multilayer protruding structure, manufacturing method thereof, filter and electronic device

A technology of resonators and bulk acoustic wave resonators, applied in the direction of electrical components, impedance networks, etc., can solve the problems of sound wave size sensitivity and insufficient sound wave reflection ability

Pending Publication Date: 2020-04-14
TIANJIN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] Figure 5C and Figure 5D The protruding structure in has the disadvantages of insufficient ability to reflect sound waves and the sensitivity of sound wave reflection performance to size

Method used

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  • Resonator with multilayer protruding structure, manufacturing method thereof, filter and electronic device
  • Resonator with multilayer protruding structure, manufacturing method thereof, filter and electronic device
  • Resonator with multilayer protruding structure, manufacturing method thereof, filter and electronic device

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Embodiment Construction

[0062] The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention, but should not be construed as a limitation of the present invention.

[0063] A bulk acoustic wave resonator according to an embodiment of the present invention will be described below with reference to the drawings. It should be pointed out that, in the embodiments of the present invention, although the thin film bulk acoustic resonator is used as an example for illustration, these descriptions can be applied to other types of bulk acoustic wave resonators.

[0064] Figure 1A It is an embodiment of the present invention, and the figure shows the structure of the edge portion of the top electrode, in which a dou...

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Abstract

The present invention relates to a bulk acoustic wave resonator, and the resonator comprises a substrate; an acoustic mirror; a bottom electrode disposed over the substrate; a top electrode facing thebottom electrode and having an electrode connection portion; a piezoelectric layer which is arranged above the bottom electrode and between the bottom electrode and the top electrode, wherein the edge of the top electrode is provided with at least a first protruding structure and a second protruding structure which are stacked in the thickness direction of the substrate, the first protruding structure is arranged on the top electrode, and the second protruding structure is arranged on the first protruding structure; the first projection structure has a first width, the second projection structure has a second width, and a ratio of the first width to the second width is in a range of 7: 1 to 9: 7. The invention further relates to a filter and an electronic device with the filter. The invention also relates to a manufacturing method of the bulk acoustic wave resonator, and the method comprises the steps: selecting the first width of the first protruding structure and the second width ofthe second protruding structure, and enabling the ratio of the first width to the second width to be in a range from 7: 1 to 9: 7.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductors, and in particular to a bulk acoustic wave resonator and a manufacturing method thereof, a filter with the resonator, and an electronic device with the filter. Background technique [0002] Figure 5A The middle is the top view of the bulk acoustic wave resonator in the prior art, Figure 5B for along Figure 5A Schematic diagram of the cross-sectional structure taken along line A1-A2 in . exist Figure 5A and 5B In , the structure corresponding to the reference signs is as follows: [0003] 10: base [0004] 20: Acoustic mirror, in this example is a cavity, Bragg reflection layer or other equivalent sound wave reflection structure can also be used [0005] 30: bottom electrode [0006] 40: Piezoelectric film (piezoelectric layer) [0007] 50: top electrode [0008] 60: Top electrode pin [0009] AR: Effective Acoustic Area (Acoustoelectric Coupling Area) [0010] Figu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02H03H9/02H03H9/17H03H9/54
CPCH03H3/02H03H9/02015H03H9/0211H03H9/02157H03H9/171H03H9/54H03H2003/023H03H9/02118H03H9/175H03H2003/025
Inventor 张孟伦庞慰杨清瑞
Owner TIANJIN UNIV