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OLED light-emitting panel

A technology of light-emitting panel and light-emitting area, applied in the field of OLED, can solve the problems of lead occupied space and lead resistance, etc., and achieve the effect of improving the service life and reducing the array gap.

Pending Publication Date: 2020-04-21
GUAN YEOLIGHT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problems of lead wires occupying space and large lead resistance in OLED light-emitting panels with multiple light-emitting areas, the present invention provides an OLED light-emitting panel, which can ensure that the gap between light-emitting areas can be as small as possible through the arrangement of leads in space, and It can ensure that the lead resistance is as small as possible, so as to solve the contradiction between the panel aperture ratio and the lead resistance

Method used

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Examples

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Embodiment 1

[0043] Such as figure 1 As shown, the OLED light-emitting panel provided by the present invention includes a substrate and a plurality of light-emitting regions 2 arranged in an array on the substrate. Each light-emitting region 2 is provided with a corresponding lead structure 4 electrically connected thereto. It includes a laminated lead layer 41 and an insulating layer 42 , the insulating layer 42 is disposed between two adjacent lead layers 41 , and each lead layer 41 is electrically connected to the corresponding light emitting area 2 after being led out. Here, the lead structure 4 is disposed on the back side of each light-emitting region 2 , and the lead structure 4 is distributed along the horizontal or vertical direction of the light-emitting regions 2 distributed in an array.

[0044] figure 1 There are 2 rows of light-emitting areas in the center, and there are 5 light-emitting areas in each row of light-emitting areas. All light-emitting areas can be seamlessly co...

Embodiment 2

[0048] The OLED light-emitting panel provided in this embodiment includes a substrate 1 and a plurality of light-emitting regions 2 arranged in an array on the substrate 1, and array gaps 3 formed between the light-emitting regions 2 are provided with corresponding light-emitting regions 2. The electrode leads are lead structures 4 that are electrically connected. The lead structures 4 include stacked lead layers 41 and insulating layers 42. The insulating layer 42 is arranged between two adjacent lead layers 41. Each lead layer 41 is drawn out from the side and connected to the corresponding The light emitting regions 2 are electrically connected to each other.

[0049] For the case where the array gap is small, you can set as figure 2 and image 3 The structure shown in the figure realizes the three-dimensional structure of the lead, and all the lead layers are stacked together, for example, figure 2 A total of 9 light-emitting areas are set up to form a 3X3 array distri...

Embodiment 3

[0052] Such as Figure 4 As shown, the OLED light-emitting panel provided in this embodiment has a bottom-emitting structure, and the light-emitting area is further optimized on the basis of Example 2, and the three-dimensional light-emitting area is realized. Specifically, as Figure 5 As shown in the cross-sectional view, in the direction perpendicular to one side of the substrate 1, each row of light-emitting regions 2 is distributed in steps from one end of the substrate 1 to the other end, and two adjacent rows of light-emitting regions are separated by a transparent insulating layer.

[0053] The specific manufacturing process is: make the first row of light-emitting areas on the right end of the substrate, and make a lead layer electrically connected to each light-emitting area of ​​the first row in the gap between the light-emitting areas of the first row, and then emit light in the first row Fabricate a transparent insulating layer on the substrate at the end of the ...

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Abstract

The invention discloses an OLED light-emitting panel comprising a substrate and a plurality of light-emitting areas which are arranged on the substrate and distributed in an array mode. Lead structures electrically connected with the electrode leads corresponding to the light-emitting areas are arranged in the array gaps formed between the light-emitting areas or on the back sides of the light-emitting areas. Each lead structure comprises a lead layer and an insulating layer which are stacked, the insulating layer is arranged between every two adjacent lead layers, and the lead layers are ledout from the side faces or directly and electrically connected with the corresponding light-emitting areas one by one. The stacked lead structures arranged on the substrate are in a three-dimensionalshape, the array gaps formed between the light-emitting areas can be greatly reduced, even seamless gaps are achieved and the aperture opening ratio is improved; meanwhile, the resistance of the leadlayers is controlled by setting the length-width ratio according to the length of the lead layers, the brightness uniformity of the light-emitting areas at different positions is achieved, and the contradiction between the aperture opening ratio of the panel and the resistance of the leads is solved.

Description

technical field [0001] The invention relates to the technical field of OLEDs, in particular to an OLED light-emitting panel. Background technique [0002] OLED light-emitting panels with multiple light-emitting areas have great application potential in automotive applications. In addition to the thin, flexible, surface light source and other modeling advantages of OLED panels, it has become the current development trend to light up multiple light-emitting areas and display patterns. However, if there are too many light-emitting areas, it will bring challenges to the panel design, such as the lead design of the light-emitting area. It is required that the lead design not only save space as much as possible, control the line width and thinness, but also ensure that the resistance is as small as possible. In the prior art, the PCB multi-layer leads used in the multi-layer PCB board are electrically connected through "plated holes" and "through holes". will be bigger. Therefor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32H01L23/532H01L23/528
CPCH01L23/53204H01L23/53209H01L23/5283H10K59/1315
Inventor 朱映光郭立雪张国辉胡永岚陈旭于永超
Owner GUAN YEOLIGHT TECH CO LTD
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