Unlock instant, AI-driven research and patent intelligence for your innovation.

Device and method for assisting precise positioning of integrated circuit near-field scanner

An integrated circuit, precise positioning technology, applied in measurement devices, electromagnetic field characteristics, electronic circuit testing and other directions, can solve problems such as high price, positioning, metal ring damage, etc., to achieve the effect of simple structure and convenient operation

Active Publication Date: 2022-03-18
TIANJIN INST OF ADVANCED TECH +1
View PDF19 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this device can only obtain a rough Z-axis distance through the microscopic camera, and cannot accurately obtain the distance between the near-field scanning probe of the integrated circuit and the surface of the integrated circuit; since the images captured by the microscopic camera are usually two-dimensional, It is impossible to locate the X-axis and Y-axis displacement of the probe based on the microscopic camera at the same time, which seriously affects the analysis and use of the near-field scanning test results
In addition, the detection part of the probe is a precise metal ring, and the price is relatively expensive. If the height is lowered blindly, the metal ring may be damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for assisting precise positioning of integrated circuit near-field scanner
  • Device and method for assisting precise positioning of integrated circuit near-field scanner
  • Device and method for assisting precise positioning of integrated circuit near-field scanner

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This embodiment discloses a device for assisting the precise positioning of an integrated circuit near-field scanner, including a probe located directly above the integrated circuit to be tested, a computer for displacement scheduling of the probe, and a supporting three-dimensional mobile platform, as well as a prism and a microscope . refer to figure 1 , 100 is the abscissa moving axis of the near-field scanner, which is used to control the position of the probe in the X direction when positioning the probe in space. 200 is the ordinate moving axis of the near-field scanner, which is used to control the position of the probe in the Y direction when positioning the probe in space. 300 is the coordinate movement axis perpendicular to the horizontal plane of the near-field scanner, which is used to control the position of the probe in the Z direction when positioning the spatial position of the probe. The three moving axes are respectively the three reference direction...

Embodiment 2

[0033] Corresponding to the device in the above-mentioned embodiment, this embodiment discloses a method for precise positioning of an auxiliary integrated circuit near-field scanner applied in the above-mentioned device, including the following steps:

[0034] Step S1, fuzzy positioning, first accurately position the X and Y axes through the microscope, move the X and Y axes so that the probe coincides with the origin on the XY plane projection, and then observe with the naked eye, move the probe Z axis down to the distance from the surface of the integrated circuit The first height (for example: about 2mm), where the Z axis is fuzzy positioning.

[0035]Step S2, placing the prism so that the reflection image of the probe and the integrated circuit can be seen in the microscope, so as to enlarge the distance between the observation probe and the integrated circuit.

[0036] Step S3 , based on the first height between the probe and the integrated circuit, move the probe downwa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of integrated circuit detection, and discloses a device and method for assisting the precise positioning of an integrated circuit near-field scanner, so as to improve the positioning accuracy and operation convenience. The device of the present invention includes a probe located directly above the integrated circuit to be tested, a computer for displacement scheduling of the probe, a supporting three-dimensional mobile platform, and a prism and a microscope; the prism is an isosceles right-angle prism, and the slope is a mirror surface , and the bottom surface is on the same level as the integrated circuit under test; the microscope is located directly above the integrated circuit under test, and is used to observe the positional relationship between the probe and the origin. By moving the X-axis and the Y-axis, the probe and the origin are projected on the XY plane coincidence, to precisely position the probe on the X and Y axes, and also to receive the reflected light of the prism to observe, adjust, position and enlarge the vertical distance between the probe and the integrated circuit under test.

Description

technical field [0001] The invention relates to the technical field of integrated circuit detection, in particular to a device and method for assisting the precise positioning of an integrated circuit near-field scanner. Background technique [0002] With the increasingly advanced integration technology, the trend of small and simple electronic products has gradually appeared. The minimum line width of transistors has been continuously reduced. Circuit chips are placed on a small circuit board, or even multiple chips are placed in the same integrated module. In order to support the EMC design of such small-sized and highly integrated electronic products, it is necessary to perform near-field scanning of electromagnetic fields on various important components (such as integrated circuits, chips) and local areas of PCB, so as to obtain the local electromagnetic field distribution, as follows One-step EMC design provides verification and testing. Therefore, higher requirements...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R29/08
CPCG01R31/2887G01R29/0871G01R29/0814
Inventor 吴建飞张红丽郑亦菲李雅菲李宏吴健煜王宏义郑黎明刘培国
Owner TIANJIN INST OF ADVANCED TECH