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Method for assisting in testing mainboard and mainboard

A technology for auxiliary testing and motherboards, which is applied in fault hardware testing methods, detection of faulty computer hardware, error detection/correction, etc., to avoid damage, save testing resources, and improve testing efficiency and reliability.

Inactive Publication Date: 2020-05-19
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for assisting in testing the main board and the main board, which is used to solve the need to bear when performing the auxiliary test of the power-on timeout of the main board or the abnormal power-down of the main board in the prior art. The risk of soldering wires on the motherboard

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  • Method for assisting in testing mainboard and mainboard
  • Method for assisting in testing mainboard and mainboard
  • Method for assisting in testing mainboard and mainboard

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Embodiment Construction

[0022] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0023] It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic ideas of the present invention, so only the components related to the present invention are shown in the drawings rather than the number, shape and Dimensional drawin...

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Abstract

The invention provides a method for assisting in testing a mainboard and the mainboard. The method comprises the following steps that the mainboard is powered on; the substrate management control unitsends a first instruction for turning off a preset power conversion unit to the complex programmable logic unit; the complex programmable logic unit turns off the preset power conversion unit based on the first instruction, so that the mainboard enters a first test state of simulating the power-on timeout of the mainboard after being turned on; or the main board is started; the substrate management control unit sends a second instruction for turning off a preset power conversion unit to the complex programmable logic unit; and the complex programmable logic unit closes the preset power conversion unit based on the second instruction, so that the mainboard enters a second test state of simulating abnormal power failure of the mainboard. According to the invention, the risk of wire weldingduring mainboard testing is avoided, and assistance is provided for testing of mainboard power-on timeout or mainboard abnormal power failure.

Description

technical field [0001] The invention relates to the technical field of mainboard testing, in particular to a method for assisting in testing a mainboard and the mainboard. Background technique [0002] When the complex programmable logic unit detects the first test state of the power-on timeout of the main board or the second test state of the main board abnormal power-off, the usual test method is to use wires to weld the output of the power conversion unit to the load machine, through The load machine triggers the overcurrent protection of the power conversion unit to trigger the abnormal state of the power conversion unit. If the overcurrent point of the power conversion unit itself is very large (>10A), then using the above-mentioned wire welding test method requires welding a very thick wire to withstand a large current (>10A), which brings inconvenience to the test. Even the test of a small current power supply needs to weld a wire every time it is tested, which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/22
CPCG06F11/2205G06F11/2273
Inventor 刘健飞
Owner INVENTEC PUDONG TECH CORPOARTION