Wafer test probe station

A technology of wafer testing and testing probes, which is applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., and can solve problems such as unsuitable wafer fixing and wafer fixing failure

Active Publication Date: 2020-05-26
HANGZHOU HIKMICRO SENSING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the process of realizing the present invention, the inventor found that the above method of fixing the wafer has the following problems: when in a vacuum test environment, the inside of the suction cup and the external environment are both in a vacuum state, which will cause the wafer to be fixed.
[0004] Therefore, the existing method of fixing wafers by vacuum adsorption is not suitable for fixing wafers in a vacuum test environment.

Method used

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Embodiment 1

[0041] see Figure 1 to Figure 3 As shown, the embodiment of the present invention provides a wafer test probe station, which is mainly used in the performance test of semiconductors, optoelectronic components, integrated circuits, etc., especially for the test of wafers (wafer); wherein, the wafer Refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. The probe station includes a stage 1 on which a pressure ring 2 for fixing the wafer W is provided, and a structure corresponding to the outline of the wafer is provided on the pressure ring.

[0042] In this embodiment, the corresponding means that the outline is consistent, and the structure can be installed or fixed in cooperation with each other. For example, the outline of the wafer is circular. Features to match the wafer contour to hold the wafer in place.

[0043] In an embodiment of the present invention, a wafer test probe ...

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Abstract

The embodiment of the invention discloses a wafer test probe station, relates to the technical field of silicon wafer test, and can be suitable for fixing a wafer in a vacuum test environment. The wafer fixing station comprises a carrying table, a pressing ring used for fixing a wafer is arranged on the carrying table, and a structure corresponding to the outline of the wafer is arranged on the pressing ring. The station is suitable for performance testing of semiconductors, photoelectric components, integrated circuits and the like, and is particularly suitable for testing of wafers.

Description

technical field [0001] The invention relates to the technical field of silicon wafer testing, in particular to a wafer testing probe station. Background technique [0002] At present, when testing wafers under standard atmospheric pressure, vacuum adsorption is usually used to fix the wafer. The principle is to use vacuum negative pressure to "adsorb" the workpiece to achieve the purpose of clamping the workpiece. When it works, a pressure vacuum state is formed inside the suction cup, which is lower than the external atmospheric pressure. The workpiece, such as a wafer, is adsorbed and fixed under the action of external pressure. The higher the vacuum inside the suction cup, the tighter the adsorption and fixation between the two. [0003] In the process of realizing the present invention, the inventor found that the above method of fixing the wafer has the following problems: when in a vacuum test environment, the inside of the chuck and the external environment are both i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
CPCG01R1/07342
Inventor 刘旭峰
Owner HANGZHOU HIKMICRO SENSING TECH CO LTD
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