Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system for automatically adding heat dissipation holes in PCB design

A technology of automatic addition and opening size, applied in CAD circuit design, computer-aided design, calculation, etc., can solve the problems of low efficiency, low opening rate, easy to miss and open holes, etc., to solve the problem of low opening rate , to solve the effect of low efficiency

Active Publication Date: 2020-06-02
INSPUR SUZHOU INTELLIGENT TECH CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method and system of the present invention solve the problem of low opening rate and easy omission of openable points caused by manual search of openable areas in the existing solutions, as well as low efficiency caused by manual addition of openable borders and forbidden areas. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for automatically adding heat dissipation holes in PCB design
  • Method and system for automatically adding heat dissipation holes in PCB design
  • Method and system for automatically adding heat dissipation holes in PCB design

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049]In order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below through specific implementation methods and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily limi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention discloses a method and system for automatically adding heat dissipation holes in PCB design, and the method specifically comprises the steps: searching an open region on a PCB, and enabling the open region to be one or more closed regions; creating an openable sub-region outline greater than or equal to the original pixel in all the open regions; merging all the sub-region outlines capable of being perforated on the PCB, drawing an upper boundary for the merged outlines, and taking the boundary size of the merged outlines as the perforation size of the perforated region; and performing expanding outwards by 20 mil according to the size of the open pore, and drawing an outer frame for forbidding all layers of wiring, wherein the outer frame is the forbidden area Rout keepout _ all. The method and the system provided by the embodiment of the invention are used for automatically searching all areas capable of being perforated in the PCB; and the outline andthe forbidden area are rapidly added, so that the problems of low aperture ratio and easy omission of the openable points caused by manual search of the openable area and low efficiency caused by manual addition of the openable frame and the forbidden area in the existing scheme are solved.

Description

technical field [0001] The invention relates to the technical field of PCB design, in particular to a method and system for automatically adding heat dissipation openings in PCB design. Background technique [0002] There are many kinds of PCB design software on the market. Cadence is the most widely used software in the industry. Cadence not only has powerful functions and a variety of related software as support, but also provides an open secondary development interface and a relatively complete development language. Library, users can carry out secondary development according to their own needs. Skill language is a high-level programming language based on C language and LISP language built into Cadence software. Cadence provides rich interactive functions for skill language. Researching skill language and then writing auxiliary tools for application can greatly improve work efficiency. [0003] In the server system architecture, the heat dissipation of the front backplan...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/392G06F115/12
Inventor 王英娜
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com