Double-sided adhesive tape punching process

Abstract

The invention provides a double-sided adhesive tape punching process. The double-sided adhesive tape punching process comprises the following steps of performing die cutting by using a cutting die, laminating the adhesive surface of a double-sided adhesive tape and a blue film by using a laminating machine to form a material coil, punching by using a first cutting die, punching first positioning holes in the left side and the right side of the material coil, and punching a broken knife edge between the two first positioning holes; punching by using a second cutting die, and punching an inner frame and a second positioning hole of the product on the second cutting die by using the first positioning hole; and punching by using a third cutting die, punching the shape of the outer frame of theproduct on the third cutting die by using the second positioning hole, punching the outer frame into a full-penetration shape, and punching into a single product to obtain a finished product. Compared with the prior art, the double-sided adhesive tape punching process adopts different trepan borings to punch a product structure, reduces accumulated tolerance, ensures that dimensional tolerance values of an inner frame and an outer frame of a product can be easily controlled, can independently adjust the size of the outer frame or the inner frame without correlation change, reduces the mold adjusting difficulty, and saves the mold adjusting time.

Description

Technical field [0001] The invention relates to the technical field of die-cutting, in particular to a double-sided tape punching process. Background technique [0002] Die-cutting products are widely used in the electronic and electrical industry, automobile manufacturing industry, flat-panel display industry and other industrial fields, especially the products that are applied to layered thin materials during the preparation process, such as insulating materials, shockproof materials, heat-resistant materials, and adhesive stickers Materials, dustproof materials, shielding materials, etc., all require die-cutting technology for processing and manufacturing. Die-cutting products have a wide range of applications, widely used in high-tech products such as electronics, electrical appliances, instruments, communication equipment, digital products, medical equipment, etc., and play different roles in different products. When punching double-sided tape products, some parts with hole...

AI Technical Summary

Problems solved by technology

When punching double-sided adhesive products, some parts with holes in the middle will use the same positioning column and positioning hole to punch the inner and outer frames of the product, which is prone to cumulative tolerances, resulting in unstable product dimensional tolerances. When adjusting the mold, adjusting the tolerance of the inner frame will easily lead to changes in the size of the outer frame, making it difficult to adjust the mold

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