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Field device

A field device and temperature switch technology, applied in electrical equipment shell/cabinet/drawer, printed circuit, program control, etc., can solve the problems of complex structure and difficult miniaturization of field equipment, and achieve miniaturization and low cost. Effect

Pending Publication Date: 2020-06-09
YOKOGAWA ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the field device disclosed in Patent Document 1 has a complex structure, making it difficult to reduce the size and cost of the device.

Method used

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no. 1 approach

[0059] figure 2 It is a functional block diagram showing a schematic configuration of the field device 1 of the first embodiment. The field device 1 of the first embodiment includes a main unit 200 and a case 300 housing the main unit 200 . The configuration of the main unit 200 included in the field device 1 is the same as that of the main unit 200 described in the comparative example. Therefore, the illustration and description of the detailed functional modules inside the main unit 200 are omitted here.

[0060] The field device 1 of the present embodiment is connected to the sensor 600 in the same manner as the field device 10 of the comparative example. In addition, the field device 1 of the present embodiment is configured to be connected to the power supply 100 and to receive supply of electric power from the power supply 100 in the same manner as the field device 10 of the comparative example.

[0061] The field device 1 of this embodiment includes a first temperat...

no. 2 approach

[0073] Figure 4 It is a functional block diagram showing a schematic configuration of the field device 2 of the second embodiment. The field device 2 of the second embodiment includes, like the field device 1 of the first embodiment, a case 300 , a main unit 200 housed in the case 300 , a first temperature switch 400 , and a heating element 500 . Hereinafter, the common points between the field device 2 of the second embodiment and the field device 1 of the first embodiment will be appropriately omitted, and the differences will be mainly described.

[0074] The field device 2 in this embodiment further includes a second temperature switch 401 . Such as Figure 4 As shown, the second temperature switch 401 is connected to the power supply 100 in series with the heating element 500 and in parallel with the main unit 200 and the first temperature switch 400 . The second temperature switch 401 is accommodated in the casing 300 . The second temperature switch 401 is a switch ...

no. 3 approach

[0083] Figure 6 It is a functional block diagram showing a schematic configuration of the field device 3 of the third embodiment. The field device 3 of the third embodiment includes, like the field device 1 of the first embodiment, a case 300 , and a main unit 200 and a first temperature switch 400 accommodated in the case 300 . Hereinafter, the common points between the field device 3 of the third embodiment and the field device 1 of the first embodiment will be appropriately omitted, and the differences will be mainly described.

[0084] The field device 3 of the third embodiment includes at least one other power generating element switchable with the power generating element 500 in addition to the heat generating element 500 . Figure 6 An example of a case where a plurality of other heating elements are included is shown in . Furthermore, the field device 3 includes a toggle switch 700 . The changeover switch 700 is accommodated in the housing 300 .

[0085] The other...

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PUM

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Abstract

A field device (1) includes an electronic circuit (200) connected to at least one of a sensor (600) and an actuator, a bimetal temperature switch (400) connected to a power source (100) in series withthe electronic circuit (200) and configured to turn on when rising to a first temperature, a heating element (500) connectable to the power source (100) in parallel with the electronic circuit (200)and the temperature switch (400), and a housing (300) configured to house the electronic circuit (200), the temperature switch (400), and the heating element (500).

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Japanese Patent Application No. 2018-225187 (filed on November 30, 2018), the entire disclosure of which is incorporated herein by reference. technical field [0003] The invention relates to a field device. Background technique [0004] Field devices and the like used in factories and the like are sometimes used in severe environments depending on where they are installed. For example, field devices are sometimes used in extremely low temperature environments. When used in such an extremely low temperature environment, field devices may operate unstable due to the influence of the environment. [0005] In contrast, conventionally known field devices are configured so that electronic components operate normally even when used in an extremely low temperature environment. For example, Patent Document 1 discloses a field device with a temperature control function. A sensor detects ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/042
CPCG05B19/0423H05B1/0227H05K2201/10053H05K1/18H05K3/284H05K1/0201H05K7/20H05K1/181H05B1/0213H05K5/064
Inventor 小池泰美
Owner YOKOGAWA ELECTRIC CORP