Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor device lead frame adopting TO type packaging

A lead frame and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as bending fracture, water sticking, and uneven center of gravity

Active Publication Date: 2020-06-16
天水华洋电子科技股份有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that the above-mentioned technology has water sticking to the place where it is placed, when it is taken, the center of gravity will be deviated due to the long package of the body, and the connecting parts between the ends are thinner, and the center of gravity is different. And when there is an external force pulling, it is easier to cause the problem of bending and breaking

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device lead frame adopting TO type packaging
  • Semiconductor device lead frame adopting TO type packaging
  • Semiconductor device lead frame adopting TO type packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] as attached figure 1 to the attached Figure 5 shown:

[0033] The present invention provides a lead frame of a semiconductor device in a TO type package, the structure of which includes a connecting plate t011, an outer frame t022, and a semiconductor t033.

[0034] The outer frame t022 is welded to the connecting plate t011, and the semiconductor t033 penetrates through the inside of the outer frame t022 and is connected to the connecting plate t011.

[0035] Wherein, the connecting plate t011 includes a clamping ball g01, a middle body g02, an outer abutting rod g03, an outer frame body g04, and a middle connecting bar g05. The locking ball g01 and the middle body g02 are an integrated structure, and the middle connecting bar g05 is placed inside the outer abutment rod g03, the outer abutment rod g03 and the outer frame body g04 are integrated structures, the middle body g02 is evenly distributed in the horizontal direction, the outer abutment rod g03 is a box-shap...

Embodiment 2

[0042] as attached Image 6 to the attached Figure 8 shown:

[0043] Wherein, the outer abutting rod g03 includes a clamping angle x11, a stabilizing core x22, and an intermediate layer x33, the clamping angle x11 abuts against the lower section of the intermediate intermediate layer x33, and the end of the intermediate layer x33 far away from the clamping angle x11 is connected to the stabilizer layer x33. The cores x22 are connected to each other, the clamping angle x11 is a group of two and is symmetrically distributed, the core stabilization x22 is a triangular structure, the clamping angle x11 stabilizes the overall corners, and the stationary core x22 allows the connected parts to function. Stable action, the intermediate layer x33 spaced apart the force between the outer layer and the inner.

[0044] Wherein, the clamping angle x11 includes a pocket layer z01, a direction angle z02, a core z03, and an arc pocket z04, the direction angle z02 is embedded in the pocket la...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a semiconductor device lead frame adopting TO type packaging. The semiconductor device lead frame comprises a connecting plate, an outer frame and a semiconductor, wherein thesemiconductor penetrates through the interior of the outer frame and is connected with the connecting plate. The joint part of the outer frame and the connecting plate is relatively thin and weak; a medium force body is used for mainly bearing force, and is applied in a certain direction; an extension layer on a connecting block is used for holding external force in a large area, and the stress area of the whole body is extended; a buffer body plays a role in stable support, so that when an outer pocket layer is stressed, and when the thin strip part is pulled by an external force, the counter-force fixing and protection effects are achieved; and a middle-end separation middle interlayer is borne by an inner stable core, the middle is held by a middle uniform ball, rubber separation corners on the side portions can play a role in buffering, so that an arc pocket opening can be controlled in one direction, force reversely abutting against the interior can be gathered to a certain degree, and an inner abutting object can be fixed under the bearing of certain force.

Description

technical field [0001] The invention belongs to the field of semiconductor devices, and more specifically, relates to a lead frame of a semiconductor device using TO-type packaging. Background technique [0002] The semiconductor lead frame of the TO-type package is a general frame integrated by several semiconductors, so that it can be better connected with the required contact parts, and does not need to be assembled individually. [0003] Based on the above findings of the present inventors, the existing TO-type packaged semiconductor lead frames mainly have the following deficiencies, such as: [0004] There is water sticking at the place where it is placed. When taking it, the center of gravity will be deviated due to the long package of the body, and the connection part between the ends is thin, the center of gravity is different, and there is external force pulling , it is more likely to cause bending fracture. [0005] Therefore, it is necessary to propose a lead f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L23/49541H01L23/49565
Inventor 严培刚
Owner 天水华洋电子科技股份有限公司