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A semiconductor device lead frame adopting a to-shaped package
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A lead frame, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of uneven center of gravity, deviation, bending fracture, etc.
Active Publication Date: 2021-07-09
天水华洋电子科技股份有限公司
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Problems solved by technology
[0006] In order to solve the problem that the above-mentioned technology has water sticking to the place where it is placed, when it is taken, the center of gravity will be deviated due to the long package of the body, and the connecting parts between the ends are thinner, and the center of gravity is different. And when there is an external force pulling, it is easier to cause the problem of bending and breaking
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Embodiment 1
[0032] as attached figure 1 to attach Figure 5 Shown:
[0033] The invention provides a semiconductor device lead frame adopting TO type packaging, the structure of which includes a connecting plate t011, an outer frame t022 and a semiconductor t033.
[0034] The outer frame t022 is welded to the connecting plate t011, and the semiconductor t033 penetrates through the outer frame t022 and is connected to the connecting plate t011.
[0035] Wherein, the connecting plate t011 includes a clamping ball g01, a middle body g02, an outer abutment bar g03, an outer frame body g04, and a middle connecting bar g05. g05 is placed inside the outer contact rod g03, the outer contact rod g03 and the outer frame body g04 are an integrated structure, the middle body g02 is evenly distributed in the horizontal direction, the outer contact rod g03 is a square frame structure, the The clamping ball g01 expands the internal area of the connecting parts, the clamping ball g01 connects the no...
Embodiment 2
[0042] as attached Image 6 to attach Figure 8 Shown:
[0043] Wherein, the outer abutment rod g03 includes a clamping angle x11, a stabilizing core x22, and an intermediate layer x33. The clamping angle x11 is against the lower section of the intermediate layer x33. The cores x22 are connected, and the clamping angle x11 is a group of two and distributed symmetrically. The stable core x22 is a triangular structure, and the clamping angle x11 stabilizes the corners of the whole. The stable core x22 allows the connected parts to play a role. For a stabilizing effect, the middle layer x33 separates the force between the outer layer and the inner layer.
[0044] Wherein, the clamping angle x11 includes a pocket z01, an angle z02, a lead z03, and an arc pocket z04, the angle z02 is embedded inside the pocket z01, and the lead z03 is placed inside the pocket z01, so The arc pocket z04 is against the lower end surface of the pocket layer z01, the angle z02 is a triangular structur...
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Abstract
The invention discloses a semiconductor device lead frame adopting TO-type packaging, the structure of which includes a connection board, an outer frame, and a semiconductor, the semiconductor runs through the inside of the outer frame and is connected to the connection board, and the connecting part between the outer frame and the connection board is relatively small Weak, the most important bearing force is the middle force body, which is displayed along a certain direction. The extension layer on the connecting block covers a large area of the external force, extending the overall force bearing area, and the slow body between them plays a role in it. The function of the stabilizer allows the outer pocket layer to act as a counter force fixation and protection when the thin strip is subjected to external force when it is under force. The middle is covered by a uniform ball, and the side rubber corners will act as a buffer, so that the arc pocket can be controlled in one direction, and the internal resisting force can be gathered to a certain extent, so that it can Fix the internal conflicting objects under a certain force.
Description
technical field [0001] The invention belongs to the field of semiconductor devices, and more specifically relates to a semiconductor devicelead frame adopting a TO type package. Background technique [0002] The semiconductor lead frame of its TO-type package is a general frame that is connected by several semiconductors, so that it can be better connected with the parts that need to be contacted, and does not need to be assembled individually. [0003] Based on the above-mentioned inventor's discovery, the existing TO-type packaged semiconductor lead frame mainly has the following deficiencies, such as: [0004] There is water sticking to the position where it is placed. When it is taken, the center of gravity will deviate due to the long package of the body, and the connecting parts between the ends are thinner, the center of gravity is different, and there is external force pulling , it is easier to cause bending fracture. [0005] Therefore, it is necessary to propose...
Claims
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Application Information
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