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Emitted light power monitoring device and preparation method thereof

A monitoring device and technology for emitting light, applied in the field of optical communication, can solve the problem that the monitoring scheme of emitted light power cannot be applied to optical module products, etc., and achieve the effect of reliable optical power monitoring

Active Publication Date: 2020-06-16
YANGTZE OPTICAL FIBRE & CABLE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The embodiment of the present application solves the problem that the emission optical power monitoring solution in the prior art cannot be applied to the optical module products using the COB packaging process by providing an emission optical power monitoring device and its preparation method

Method used

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  • Emitted light power monitoring device and preparation method thereof
  • Emitted light power monitoring device and preparation method thereof
  • Emitted light power monitoring device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] This embodiment provides a device for monitoring emitted light power, including: a laser, a detector body, a detector insulating carrier, and a PCB.

[0036] like image 3 As shown, the PCB is provided with differential signal lines (ie image 3 The two thin and long PCB traces in), the pad (ie image 3 two square PCB traces), the pads are located on both sides of the differential signal line. The laser is connected to the laser driver through the differential signal line.

[0037] The detector insulating carrier is disposed between the laser and the laser driver, and the first surface of the detector insulating carrier is in contact with the PCB.

[0038] Since the first surface of the detector insulating carrier close to the differential signal line is non-conductive, the detector insulating carrier will not affect the signal quality of the differential signal line. In addition, the upper surface of the differential signal line is covered with green oil, which can...

Embodiment 2

[0049] An emission optical power monitoring device provided in Embodiment 2 includes N monitoring units, each of which includes one of the lasers, one of the detector bodies, and one of the detector insulating carriers, and N of the monitoring units The units share one said PCB.

[0050] In one design solution, 2N pads are provided on the PCB.

[0051] In another design solution, part of the pads may be shared between some adjacent monitoring units. For example, if a device for monitoring optical power includes four monitoring units (respectively denoted as the first road, the second road, the third road, and the fourth road), then only six solder pads can be arranged on the PCB. , one pad can be shared between the first and second monitoring units, and one pad can be shared between the third and fourth monitoring units.

[0052] The following takes the 100G CWDM4 optical module as an example to describe the transmitting optical power monitoring device.

[0053] Since the 1...

Embodiment 3

[0061] Embodiment 3 provides the preparation method of the above-mentioned emission optical power monitoring device (emission optical power monitoring device in embodiment 1 or embodiment 2), which mainly includes the following steps:

[0062] Step 1. Preset pads and differential signal lines on the PCB;

[0063] Step 2, attaching the insulating carrier of the detector to the PCB, and connecting the pad of the PCB with the gold-plated area of ​​the insulating carrier of the detector through conductive silver glue;

[0064] Step 3, attaching the detector body to the detector insulating carrier, and electrically connecting the detector body and the gold-plated area of ​​the detector insulating carrier;

[0065] Step 4, mounting a laser on the PCB, and connecting the laser to the differential signal line through a gold wire.

[0066] Taking the 100G CWDM4 optical module as an example, the preparation method of the emission optical power monitoring device includes the following s...

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Abstract

The invention belongs to the technical field of optical communication, and discloses an emitted light power monitoring device and a preparation method thereof, and the device comprises a laser, a detector body, a detector insulation carrier, and a PCB. The PCB is provided with a differential signal line and a bonding pad. The laser is connected with the laser driver through the differential signalline; the detector insulation carrier is arranged between the laser and the laser driver and is in contact with the PCB; the first partial area of the back surface of the detector body is attached tothe second surface of the detector insulation carrier, the photosensitive surface of the detector body faces the backlight end of the laser, and the detector body and the PCB are spaced by a first distance; a gold plating area is arranged on the second surface of the detector insulation carrier; the detector body is connected with the gold plating area, and the gold plating area is connected withthe bonding pad of the PCB. The problem that a transmitting optical power monitoring scheme in the prior art cannot be suitable for an optical module product adopting a COB packaging process is solved, and reliable optical power monitoring can be realized.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a device for monitoring emitted light power and a preparation method thereof. Background technique [0002] With the advent and continuous development of the data age, information transmission channels are stable and smooth, and information security is gradually being valued by everyone. As a key material in the optical communication system, the optical module's performance in the system directly affects the stability and security of the optical communication system. Effective monitoring of the working status of the optical modules in the system is an important guarantee to ensure the stability of the communication system. Therefore, whether it is an optical module manufacturer, an equipment manufacturer, or an operator, everyone pays more and more attention to the monitoring of the working status of the optical module, and the monitoring of the optical power emitt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/079H04B10/80H04B10/50
CPCH04B10/07955H04B10/503H04B10/802H04B10/803
Inventor 鲁振华梁付运汤金宽
Owner YANGTZE OPTICAL FIBRE & CABLE CO LTD
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