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Quick glue dispensing device for circuit board production

A dispensing device and circuit board technology, which is applied to the surface coating liquid device, printed circuit, printed circuit manufacturing, etc., can solve the problems of low service life of the dispensing head, affect work efficiency, replacement, etc., and achieve the adjustment coverage Wide range, improved service life, and improved dispensing accuracy

Active Publication Date: 2020-06-19
XUCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing dispensing machine is used for dispensing, it often occurs that the adjusting range of the dispensing machine is too small to be applicable to more circuit boards. In addition, according to the collected data and analysis, it can be seen that dispensing The dispensing head in the barrel has a low service life and often needs to be replaced, which affects work efficiency

Method used

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  • Quick glue dispensing device for circuit board production
  • Quick glue dispensing device for circuit board production
  • Quick glue dispensing device for circuit board production

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Embodiment Construction

[0024] see Figure 1~4 , in an embodiment of the present invention, a rapid dispensing device for circuit board production, including a main console 1, a driving arm 2, a position and angle adjustment assembly 4, a clamping seat 5, and a dispensing assembly 6, the main control The left end of the table is provided with a driving arm 2, and the driving arm 2 is connected with a position and angle adjustment assembly 4 by using a mounting seat 3. The position and angle adjustment assembly 4 can adjust the clamping seat 5 arranged at its output end, thereby changing the clamping position. The position of the holding seat 5 and the angle between it and the horizontal plane, the dispensing assembly 6 is fixed on the holding seat 5, and the circuit board placement frame 7 is also fixed on the main console 1, so as to place the circuit board.

[0025] In this embodiment, the position and angle adjustment assembly 4 includes a base 8, a fixing frame 11, a primary adjustment assembly, ...

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Abstract

The invention discloses a quick glue dispensing device for circuit board production. The device comprises a main console, a driving arm, a position and angle adjusting assembly, a clamping seat and aglue dispensing assembly, wherein the driving arm is arranged at the left end of the main console, the driving arm is connected with the position and angle adjusting assembly through a mounting seat,the position and angle adjusting assembly comprises a first-stage adjusting assembly and a second-stage adjusting assembly, the first-stage adjusting assembly and the second-stage adjusting assembly can drive the glue dispensing assembly to move so as to adjust the position, located above a circuit board containing frame, of the glue dispensing assembly, the adjusting coverage range of the first-stage adjusting assembly and the second-stage adjusting assembly is wide, the precision is high, in addition, an angle adjusting assembly is arranged at the output end of the second-stage adjusting assembly, the angle adjusting assembly can drive the glue dispensing assembly to rotate, so that the included angle between the glue dispensing assembly and a horizontal plane is changed, the incident angle of glue injected into a circuit board is changed, the glue dispensing precision is improved, the glue dispensing assembly is fixed to the clamping seat, and the circuit board containing frame is further fixed to the main console so as to contain the circuit board.

Description

technical field [0001] The invention specifically relates to the field of glue dispensing technology, in particular to a fast glue dispensing device for circuit board production. Background technique [0002] From the manufacturing process of the circuit board (PCB), we can see that the components on one side of the circuit board are glued and solidified from the beginning, and then wave soldering can only be performed at the end. During this period, the interval time is long, and there are many other processes. , the curing of the components is particularly important, so it is of great significance for the research and analysis of the dispensing process. [0003] When the existing dispensing machine is used for dispensing, it often occurs that the adjusting range of the dispensing machine is too small to be applicable to more circuit boards. In addition, according to the collected data and analysis, it can be seen that dispensing The dispensing head in the barrel has a low...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/00H05K3/00
CPCB05C5/0208B05C11/00H05K3/00
Inventor 郭晓阳郭利辉杨振宇
Owner XUCHANG UNIV
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