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Heat transfer heat storage sheet and its preparation method and heat dissipation structure

A heat dissipation structure and heat storage technology, applied in chemical instruments and methods, heat exchange materials, semiconductor/solid-state device manufacturing, etc., can solve the problem of poor heat transfer performance, long heat storage and heat storage time, and reduced thermal efficiency of heat storage systems To achieve the effect of improving heat storage efficiency and speed, high energy storage density, and improving thermal conductivity

Active Publication Date: 2021-09-28
SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the phase change materials have the problem of low thermal conductivity, which makes the heat transfer performance of the heat storage system poor, and the heat storage and heat storage time is longer, which in turn reduces the thermal efficiency of the system.

Method used

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  • Heat transfer heat storage sheet and its preparation method and heat dissipation structure
  • Heat transfer heat storage sheet and its preparation method and heat dissipation structure
  • Heat transfer heat storage sheet and its preparation method and heat dissipation structure

Examples

Experimental program
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preparation example Construction

[0040] see figure 2 , a preferred embodiment of the present invention also provides a method for preparing a heat transfer heat storage sheet, comprising the following steps:

[0041] S11, mixing the thermally conductive filler and the two-component silica gel to obtain a heat transfer phase material.

[0042] Specifically, weigh a certain amount of heat-conducting filler for dry mixing, add two-component silica gel after mixing evenly, and then vacuum stir for 2-4 hours after stirring to perform defoaming treatment, and use a press to press the material to obtain a heat transfer phase Material.

[0043] S12, mixing the thermally conductive filler, the micro / nanocapsule phase change material and the two-component silica gel to obtain a thermal storage phase material.

[0044] Specifically, weigh a certain mass of the thermally conductive filler and the micro / nanocapsule phase change material, and perform dry mixing. After mixing evenly, add the two-component silica gel, and...

Embodiment 1

[0057] The first step is to weigh 38g of 300-mesh desulfurized graphite and 34.8g of two-component silica gel. After stirring, vacuum stir for 2-4 hours to carry out degassing treatment and make it into a heat transfer phase material.

[0058] Step 2: Weigh 5g of alumina with a particle size of 5μm and 44g of micro / nanocapsule phase change material with a particle size of 5μm, mix well and add 16g of the two-component silica gel, stir in vacuum for 2-4 hours after stirring To carry out defoaming treatment, dubbed as heat storage phase material.

[0059] The third step is to transfer the heat transfer phase material and the heat storage phase material in the first step and the second step into the printing tubes A and B respectively, and vacuumize them respectively.

[0060] The fourth step is to connect the two printing tubes to the 3D printer for printing, and set the program of the printer and the sequence of the output. After the first layer of heat transfer phase material ...

Embodiment 2

[0064] The first step is to weigh 42g of boron nitride powder with a particle size of 50μm, 70g of 300 mesh desulfurized graphite and 106.6g of two-component silica gel, and then vacuum stir for 2-4h after stirring for degassing treatment. thermal phase material.

[0065] Step 2: Weigh 17g of 300-mesh graphite and 115g of micro / nanocapsule phase-change materials with a particle size of 5μm, mix well and add 55g of the two-component silica gel, and then vacuum stir for 2-4h after stirring for degassing , dubbed as heat storage phase material.

[0066] The third step to the fourth step are the same as the third step to the fourth step in the embodiment 1, please refer to the embodiment 1.

[0067] The fifth step is different from the fifth step in Example 1 in that: the curing temperature is set to 100° C., and the curing time is set to 10 h.

[0068] The sixth step is the same as the sixth step in Example 1, please refer to Example 1.

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Abstract

The invention discloses a heat transfer heat storage sheet, comprising: a heat transfer layer, the heat transfer layer includes a silica gel matrix and a thermally conductive filler located in the silica gel matrix, and the thermally conductive filler includes a directional distribution of one-dimensional material, a two-dimensional Dimensional materials and randomly distributed three-dimensional materials; and a heat storage layer, the heat storage layer and the heat transfer layer are stacked, and the heat storage layer includes the silica gel matrix and the thermally conductive filler located in the silica gel matrix As with phase change materials, the phase change materials include shape-setting phase change materials. The heat transfer heat storage sheet provided by the present invention has the characteristics of small filling amount of filler, high thermal conductivity, good heat transfer performance of the heat storage system, short heat storage and heat storage time, and high heat exchange efficiency. The invention also discloses a preparation method of the heat transfer heat storage sheet and a heat dissipation structure.

Description

technical field [0001] The invention relates to the technical field of heat transfer and heat storage materials, in particular to a heat transfer and heat storage sheet, a preparation method thereof, and a heat dissipation structure. Background technique [0002] In recent years, with the increasing integration of electronic components such as chips and power devices, the demand for heat dissipation has become higher and higher, the heat dissipation space has become smaller and smaller, and the heat flux density has become higher and higher. Design requirements are also getting higher and higher. At present, electronic components generally dissipate heat by adjoining the heat sink on the heating surface of the electronic component. There will be contact thermal resistance between the surface of the heat source and the contact surface of the heat sink. At the same time, the surface of the heat source and the surface of the heat sink have a certain roughness, so that the conta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H01L23/367H01L23/373H01L21/48C09K5/02
CPCC09K5/02H01L21/4871H01L23/367H01L23/373H01L23/3738H01L23/427
Inventor 杜鸿达陈威龙晴明于孟雪康飞宇
Owner SHENZHEN GRADUATE SCHOOL TSINGHUA UNIV