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A technology of gas and gas expansion, applied in cleaning methods, cleaning methods and utensils using gas flow, semiconductor/solid-state device manufacturing, etc., and can solve problems such as small device features
Pending Publication Date: 2020-06-26
东京毅力科创美国制造与工程公司
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[0007] However, advances in microelectronic IC fabrication have resulted in smaller device features on substrates
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[0038] Methods for selectively removing objects from microelectronic substrates are described in various embodiments. Those skilled in the relevant art will recognize that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the various embodiments of the present disclosure. Similarly, for purposes of illustration, specific numbers, materials and configurations are set forth to provide a thorough understanding of the systems and methods. However, the systems and methods may be practiced without the specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations, and except Figure 6A and Figure 6B Additionally, the drawings are not necessarily drawn to scal...
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Abstract
Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, and in particular, relate to an apparatus and method for scanning the microelectronic substrate through a cryogenic fluid mixture used to treat an exposed surface of the microelectronic substrate. In particular, an improved nozzle design used to expand the fluid mixture is disclosed herein. In one embodiment, the nozzle design incorporates a two nozzle pieces are combined to form a single nozzle design, in which the two pieces are slight misaligned to form a unique orifice design. In another embodiment, two pieces are combined and aligned along a common axis of the fluid conduit. However, an offset piece is inserted between the two pieces and has a hole that misaligned from the flow conduits of the two other pieces.
Description
[0001] priority statement [0002] This application claims the benefit of U.S. Nonprovisional Patent Application Serial No. 15 / 681,105, filed August 18, 2017, the disclosure of which is incorporated herein by reference in its entirety. [0003] related application [0004] U.S. nonprovisional application 15 / 681,105 filed August 18, 2017 is a continuation-in-part of U.S. nonprovisional application 15 / 197,450 filed on June 29, 2016 and claims the U.S. nonprovisional application filed on June 29, 2016 Priority to application 15 / 197,450, U.S. nonprovisional application 15 / 197,450, U.S. Provisional Patent Application No. 62 / 060,130, filed October 6, 2014, U.S. Provisional Patent Application No. 62 / 060,130, filed March 31, 2015 62 / 141,026 and a continuation-in-part of U.S. Nonprovisional Patent Application No. 14 / 876,199, filed October 6, 2015 and claiming U.S. Provisional Patent Application No. 62 / 060,130, filed October 6, 2014, at Priority to U.S. Provisional Patent Application No...
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