A kind of embedded chip and its preparation method

An embedded and chip technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as damage, chip damage, and static electricity, and achieve the effect of static electricity protection
CN111354645BActive Publication Date: 2022-04-12SHENNAN CIRCUITS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENNAN CIRCUITS
Publication Date
2022-04-12

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Abstract

The invention provides an embedded chip and a preparation method thereof. When the embedded chip is patterned and plated on a circuit board, a conductive closed-loop structure surrounding the chip body inside the circuit board is formed, so that the chip The pin pads of the main body are connected to each other through a conductive closed-loop structure, and then when the chip pins are subsequently formed, the electrostatic current generated by cutting the chip can be dispersed through the conductive closed-loop structure to achieve electrostatic protection for the chip.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor chips, in particular to an embedded chip and a preparation method thereof. Background technique

[0002] With the development of the information society, the amount of information processed by various electronic devices is increasing day by day, and the demand for high-frequency and high-speed signal transmission is increasing day by day. Embedding the semiconductor chip in the circuit board for packaging can effectively shorten the connection distance between the semiconductor chip and the packaging substrate, and provide a strong guarantee for high-frequency and high-speed signal transmission. Bare chips embedded in circuit boards can also meet the development needs of high integration of packages and miniaturization of electronic products.

[0003] In the prior art, the bare chip is usually prepared for embedding the circuit board by attaching the bare chip to the circuit board, and the ...

Claims

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