A kind of embedded chip and its preparation method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENNAN CIRCUITS
- Publication Date
- 2022-04-12
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor chips, in particular to an embedded chip and a preparation method thereof. Background technique
[0002] With the development of the information society, the amount of information processed by various electronic devices is increasing day by day, and the demand for high-frequency and high-speed signal transmission is increasing day by day. Embedding the semiconductor chip in the circuit board for packaging can effectively shorten the connection distance between the semiconductor chip and the packaging substrate, and provide a strong guarantee for high-frequency and high-speed signal transmission. Bare chips embedded in circuit boards can also meet the development needs of high integration of packages and miniaturization of electronic products.
[0003] In the prior art, the bare chip is usually prepared for embedding the circuit board by attaching the bare chip to the circuit board, and the ...