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52results about How to "Realize electrostatic protection" patented technology
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Touch screen display panel and touch screen display device
ActiveCN103941908AImprove yield rateRealize electrostatic protectionNon-linear opticsInput/output processes for data processingElectricityDisplay device
Owner:SHANGHAI TIANMA MICRO ELECTRONICS CO LTD +1
Space electrostatic protection solar cell array interconnection package structure and method
ActiveCN106549072AWith electrostatic dredging functionSpatial stabilitySemiconductor/solid-state device detailsSolid-state devicesHigh resistanceGlass cover
The present invention discloses a space electrostatic protection solar cell interconnection package structure and a method. The space electrostatic protection solar cell interconnection package structure disclosed by the invention comprises a substrate, solar cells and anti-radiation conductive glass cover sheets; the surface of the substrate is coated with a layer of high-resistance conductive adhesive; the solar cells are bonded onto the surface of the substrate; one missing corner of each solar cell is connected in parallel with a bypass diode; the conductive layers of the anti-radiation conductive glass cover sheets are far away from the solar cells and cover the surfaces of the solar cells; the upper surface, lower surface and corresponding side surfaces of one corner of each anti-radiation conductive glass cover sheet are plated with metal thin films; and the metal thin films are connected in series with the bypass diodes through the high-resistance conductive adhesive. The method of the invention is not only compatible with a traditional solar cell ray assembly process, but also is simple and reliable. With the method adopted, automatic assembly can be realized.
Owner:SHANGHAI INST OF SPACE POWER SOURCES
Ground structure and mobile terminal
ActiveCN107205064ARealize electrostatic protectionAvoid layeringDigital data processing detailsPrinted circuitsElectricityElectrical battery
The invention provides a ground structure and a mobile terminal. The ground structure comprises a touch screen ground wire, a voltage clamper and a metal middle frame, wherein a first end of the voltage clamper is electrically connected with the touch screen ground wire, a second end of the voltage clamper is electrically connected with the metal middle frame, the touch screen ground wire is arranged on a frame of a touch screen of the mobile terminal and used for releasing static electricity entering from the side of the touch screen. Thus, when the static electricity enters the mobile terminal from the side of the touch screen, the ground structure can release the static electricity to realize static electricity protection of the mobile terminal, and meanwhile, when no static electricity enters the mobile terminal from the side of the touch screen, the problem of layering of the touch screen ground wire and the touch screen due to the galvanic effect because the touch screen ground wire and the metal middle frame contact with electrolyte simultaneously can be solved effectively.
Owner:VIVO MOBILE COMM CO LTD
Display panel, manufacturing method thereof and display device
ActiveCN111445797AImprove electrostatic protection abilityGuaranteed display qualityElectrostatic chargesIdentification meansComputer hardwareDisplay device
The invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a display area and a non-display area surrounding the display area; the displayarea comprises a plurality of data lines; the non-display area comprises detection switches in one-to-one correspondence with the at least one data line, and a crack detection line and an electrostatic discharge circuit that surround the display area; a crack detection point is arranged on the crack detection line; the crack detection line comprises a first end part and a second end part; the first end part is electrically connected with the electrostatic discharge circuit, the second end part is electrically connected with a detection signal input end of the crack detection point, the inputend of each detection switch is electrically connected with the crack detection line, and the output end of each detection switch is electrically connected with the corresponding data line. The display panel is used for achieving electrostatic protection of screen crack detection and improving the display quality of the display panel.
Owner:BOE TECH GRP CO LTD +1
Printed circuit board
ActiveCN103607838ARealize electrostatic protectionStop shockPrinted circuit detailsElectrostatic chargesEngineeringPrinted circuit board
The invention discloses a printed circuit board. The printed circuit board is provided with a shield ground, a system ground and a power source ground, wherein the system ground is provided with at least one element. The printed circuit board is also provided with a trench capable of blocking current. The trench is disposed between the shield ground and the system ground. The power source ground respectively gets the shield ground and the system ground conducted for releasing the static electricity on the shield ground and the system ground. The printed circuit board provided by the invention solves the technical problem that the elements on a conventional printed circuit board are easily damaged due to the impact of the static electricity.
Owner:QINGDAO GOERTEK
Sealing ring structure and preparation method thereof
ActiveCN112701116AAchieve mechanical protectionAvoid damageTransistorSemiconductor/solid-state device detailsDevice materialSemiconductor
The invention discloses a sealing ring structure and a preparation method thereof and relates to the technical field of integrated circuits. The sealing ring structure comprises an enhanced high-electron-mobility transistor, a diode group and a resistor which are manufactured through a semiconductor epitaxial layer, the enhanced high-electron-mobility transistor is used for being annularly arranged on the periphery of a device region of a semiconductor device, and the diode group and the resistor are used for being arranged on the periphery of the device region; the anode of the diode group is in metal connection with the first electrode of the semiconductor device, the cathode is in metal connection with the first metal end of the resistor, and the second metal end of the resistor is in metal connection with the second electrode of the semiconductor device; and the grid electrode of the enhanced high-electron-mobility transistor is connected with the cathode metal of the diode group, the drain electrode is used for being connected with the first electrode metal, and the source electrode is used for being connected with the second electrode metal of the semiconductor device. The sealing ring structure can realize an electrostatic protection function by utilizing the sealing ring region, so that the area of the device is saved.
Owner:湖南三安半导体有限责任公司
Anti-static conveyer belt device with adjustable distance
InactiveCN106044067AEasy Adjustment and RetrofitRealize electrostatic protectionConveyorsEngineeringBelt machine
The invention relates to an antistatic conveyor belt device with adjustable distance, which comprises a conveyor belt body installed on a conveyor belt machine platform, metal wires embedded in the conveyor belt body and exposed on the surface, distance control components installed at both ends of the conveyor belt platform, and installation Adjustment control assembly on the lower part of the conveyor table. The distance control component and the adjustment control component can work together to adjust the transmission distance of the conveyor belt, and adjust the transmission distance of the conveyor belt in real time according to production needs, thereby achieving the effect of lean production. The metal wire can be in contact with the object to be conveyed and grounded through the conveying machine platform to achieve the effect of preventing static electricity.
Owner:SUZHOU GAOTONG MACHINERY TECH CO LTD
Electrostatic protection circuit
PendingCN112420688ADoes not affect workRealize electrostatic protectionTransistorSolid-state devicesCapacitanceHemt circuits
The embodiment of the invention relates to an electrostatic protection circuit design, and discloses an electrostatic protection circuit. The circuit comprises an electrostatic protection module; an input / output end, a power supply end and a grounding end, wherein the electrostatic protection module comprises a first NMOS transistor, a first capacitor and a first resistor; a source electrode and asubstrate of the first NMOS transistor are connected with the input and output end, and a drain electrode of the first NMOS transistor is connected with the grounding end; the first end of the firstcapacitor is connected with the grounding end, and the second end of the first capacitor is connected with the grid electrode of the first NMOS transistor; the first end of the first resistor is connected with the input and output end, and the second end of the first resistor is connected with the grid electrode of the first NMOS transistor. According to the electrostatic protection circuit disclosed by the invention, the electrostatic protection of the internal circuit can be effectively realized while the work of the internal circuit is not influenced.
Owner:CHANGXIN MEMORY TECH INC
Processing method of multipath electrostatic discharge (ESD) protector
ActiveCN103107127AReduce processing difficulty and manufacturing costLow parasitic capacitance and leakage currentSemiconductor/solid-state device manufacturingElectrostatic dischargeElectrical and Electronics engineering
The invention discloses a processing method of a multipath electrostatic discharge (ESD) protector. The processing method of the multipath ESD protector comprises that N through holes are formed in a first base material which comprises a first conducting layer, a second conducting layer and a first insulating layer located between the first conducting layer and the second conducting layer; the N through holes are filled with conducting materials; pattern processing is carried out on the second conducting layer; pattern processing is carried out on the first conducting layer and / or blind grooves penetrating through the first conducting layer to the first insulating layer are machined on the first conducting layer, and a first resin layer is arranged on the first conducting layer; a protective layer is arranged on the first resin layer, N / 2 blind holes penetrating from the protective layer to the first insulating layer are formed in the protective layer; the N / 2 blind holes are filled with slurry; the protective layer is peeled from the first resin layer; and a protective upper body is arranged on the first resin layer. By means of the processing method, manufacturing cost of the ESD protector can be lowered, and safety of the ESD protector can be improved.
Owner:SHENZHEN ZSIPAK TECH CO LTD
Water level collecting system and method
InactiveCN110147065AAvoid damageRealize electrostatic protectionProgramme controlComputer controlDividing circuitsWater level
The invention provides a water level collecting system. The system comprises a water level gauge which is placed in a water tank and is used for generating different resistance values according to thewater level in the water tank, and a voltage dividing circuit. One end of the voltage dividing circuit is connected with a power supply, and the other end is connected with the water level gauge. Thevoltage dividing circuit is used for dividing the power supply voltage. The system further comprises a collecting circuit which is connected with the voltage dividing circuit, and is used for acquiring the output voltage value of the voltage dividing circuit corresponding to the current water level and determining the current gear position of the water tank corresponding to the current water level according to the output voltage value and the reference voltage preset by the collecting circuit. Therefore, electrostatic protection can be realized, and the collecting circuit can be prevented from being damaged by the influence of static electricity. At the same time, a partial diagnosis function can quickly locate some faults, which improves the efficiency of troubleshooting and solving.
Owner:BEIJING ZHIXINGZHE TECH CO LTD
Output circuit structure of radio frequency powder amplifier
InactiveCN106685369AAchieve protectionAvoid overvoltage damageHigh frequency amplifiersPower amplifiersOvervoltageHarmonic
The invention discloses an output circuit structure of a radio frequency powder amplifier. The output circuit structure of the radio frequency powder amplifier comprises a triode. The base electrode of the triode is the input end, the collector electrode is the output end, and the emitter electrode is connected to the ground. The output end is connected with a harmonic trap circuit formed by serially connecting a first capacitor and an inductor, and the terminal of the inductor is connected to the ground. The output circuit structure of the radio frequency powder amplifier further comprises an ESD protective string formed by serially connecting a plurality of diodes. The positive electrode terminal of the protective string and one end of the first capacitor adjacent to the collector electrode are positioned in the same electric potential, and a node or the negative electrode terminal is connected between the first capacitor and the inductor so as to partially or totally connect with the first capacitor in parallel. The break-over voltage of the ESD protective string is smaller than the breakdown voltage of the first capacitor. The overvoltage damage of the first capacitor is avoided while the ESD protection function is realized, and the reliability is improved.
Owner:XIAMEN SANAN INTEGRATED CIRCUIT
Display panel and display device
PendingCN111613616AImprove conduction abilityRealize electrostatic protectionTransistorSolid-state devicesDisplay deviceEngineering
The embodiment of the invention relates to the technical field of display, and discloses a display panel and a display device. The display panel comprises a substrate, an MOS transistor arranged on the substrate, a first insulating layer, a first metal film, a second insulating layer and a second metal film, wherein the grid electrode and the drain electrode of the MOS transistor or the grid electrode and the source electrode of the MOS transistor are in short circuit; the first insulating layer and the MOS transistor are arranged on the same layer; the first metal film is arranged on the first insulating layer, a first through hole is formed in the first insulating layer, and the first metal film is connected with the source electrode and the drain electrode through the first through hole; the second insulating layer and the first metal film are arranged on the same layer; the second metal film is arranged on the second insulating layer, a second through hole is formed in the second insulating layer, a first TP wire is connected with the first metal film connected with the electrode, which is not short-circuited, of the MOS transistor through the second through hole, and a first grounding wire is connected with the first metal film connected with the electrode, which is short-circuited, of the MOS transistor through the second through hole. According to the display panel and the display device provided by the invention, the product yield and reliability can be improved.
Owner:YUNGU GUAN TECH CO LTD
Static protection structure in monolithic microwave integrated circuit and manufacturing method of static protection structure
ActiveCN107994015AReduce layout areaRealize electrostatic protectionTransistorSolid-state devicesMonolithic microwave integrated circuitCurrent collector
The invention provides a static protection structure in a monolithic microwave integrated circuit. Diode groups are respectively arranged in parallel between a base region and an emitter region and between the base region and a current collector region of a transistor and are arranged in a back-to-back structure, each diode group comprises two diodes, and positive electrodes of the two diodes areconnected or negative electrodes of the two diodes are connected to form the back-to-back structure. The invention provides the static protection structure in the monolithic microwave integrated circuit, and the occupancy area of the static protection structure in the integrated circuit is effectively reduced. The invention also provides a manufacturing method of the static protection structure.
Owner:XIAMEN SANAN INTEGRATED CIRCUIT
Medical air supply system and electrostatic protection circuit of communication circuit thereof
InactiveCN103066581ATroubleshooting Communication Quality DegradationRealize electrostatic protectionEmergency protective arrangements for limiting excess voltage/currentCommunication interfaceCommunication quality
The invention discloses a medical air supply system and an electrostatic protection circuit of a communication circuit of the medical air supply system. The electrostatic protection circuit comprises a first diode set, a second diode set and a third diode set, wherein the first diode set comprises a first diode and a second diode which are in series connection in a phase-inverting mode, a first end of the first diode set is grounded, and a second end of the first diode set is connected on a first signal line of the communication circuit, the second diode set comprises a third diode and a fourth diode which are in series connection in a phase-inverting mode, a first end of the second diode set is grounded, and a second end of the second diode set is connected on a second signal line of the communication circuit, and the third diode set comprises a fifth diode and a sixth diode, a first end of the third diode set is grounded, and a second end of the third diode set is connected on a power source line of the communication circuit. The communication circuit of the medical air supply system is the communication circuit between a communication interface and a communication chip. Through the electrostatic protection circuit, electrostatic protection to the communication circuit of the medical air supply system can be realized so as to enable communication to run normally, and communication quality and communication speed of the communication circuit are improved.
Owner:BEIJING AEONMED
Electrostatic protection circuit
PendingCN113540070AImprove electrostatic protection abilityRealize electrostatic protectionTransistorSolid-state devicesHemt circuitsControl theory
The embodiment of the invention provides an electrostatic protection circuit, and the circuit is connected with an internal circuit and comprises a first circuit, a first diode connected with the first circuit in parallel, a second circuit and a second diode connected with the second circuit in parallel. The first circuit is connected between the power supply bonding pad and the input end of the internal circuit, and the second circuit is connected between the input end of the internal circuit and the grounding bonding pad; and the first circuit and the second circuit are diode auxiliary trigger thyristor circuits. According to the technical scheme, the electrostatic protection capability of the charging device model of the chip can be improved.
Owner:CHANGXIN MEMORY TECH INC
Electrostatic protection method of integrated circuit
PendingCN113990863AAvoid electrostatic damageGuaranteed reliabilityTransistorSolid-state devicesCapacitanceHemt circuits
The embodiment of the invention discloses an electrostatic protection method for an integrated circuit, and the method comprises the steps: arranging the integrated circuit on a first chip, and enabling the integrated circuit to comprise an input port; arranging an electrostatic protection circuit on a second chip, wherein the electrostatic protection circuit comprises a first input lead-out port, a second input lead-out port, a first diode, a second diode, a capacitor, an N-type field effect transistor and a ground end lead-out port; and connecting the first input lead-put port with the input port, so that the electrostatic protection circuit can be connected with the integrated circuit, and the electrostatic protection circuit can perform electrostatic protection on the integrated circuit. Moreover, the integrated circuit and the electrostatic protection circuit are arranged on different chips, thereby avoiding the electrostatic protection design on the chip where the integrated circuit is located, and solving a problem that the electrostatic protection design cannot be carried out because of the limitation of the substrate material of the chip where the integrated circuit is located. And the electrostatic protection of a novel material integrated circuit which is sensitive to static electricity can be realized.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Processing method of multiple electrostatic discharge protection device
ActiveCN103107127BReduce processing difficultyReduce manufacturing costSemiconductor/solid-state device manufacturingEngineeringSlurry
Owner:SHENZHEN ZSIPAK TECH CO LTD
Novel electrostatic protection method
PendingCN113990862AAvoid electrostatic damageRealize double protectionSolid-state devicesSemiconductor devicesCapacitanceElectrical resistance and conductance
The embodiment of the invention discloses a novel electrostatic protection method. The method comprises the following steps that an integrated circuit is arranged on a first chip; an electrostatic protection circuit is arranged on a second chip, and the electrostatic protection circuit comprises a first input output port, a second input contact port, a first diode, a first resistor, a first N-type field effect transistor and a ground end output port, and further comprises a second diode, a capacitor and a second N-type field effect transistor; and the first input output port is connected with the input port of the integrated circuit, so that the electrostatic protection method can realize dual protection on the integrated circuit, and the reliability of the integrated circuit is effectively ensured. Moreover, the integrated circuit and the electrostatic protection circuit are arranged on different chips, thereby avoiding the electrostatic protection design on the chip where the integrated circuit is located, and solving a problem that the electrostatic protection design cannot be carried out because of the limitation of the substrate material of the chip where the integrated circuit is located. And the electrostatic protection of a novel material integrated circuit which is sensitive to static electricity can be realized.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Gear driving acquisition system and method
ActiveCN112413119AAvoid damageRealize electrostatic protectionGearing controlGear driveRotary switch
The invention provides a gear driving acquisition system and method. The system comprises a plurality of Hall switches, a plug connector and an MCU. The plurality of Hall switches detect the intensityof the magnetic field generated by a gear rotating switch, output a first voltage signal when the magnetic field intensity is smaller than a preset first threshold value or rises from the first threshold value to a preset second threshold value, and output a second voltage signal when the magnetic field intensity is greater than the preset second threshold value or drops from the second thresholdvalue to the first threshold value. The plug connector comprises a plurality of pins, wherein each pin is connected with the output end of one Hall switch, when the Hall switches output a first voltage signal, the pins output the first voltage signal, and when the Hall switches output a second voltage signal, the pins output the second voltage signal. The MCU is connected with the pins of the plug connector, detects the voltage signal of each pin, and determines the gear of the gear rotating switch corresponding to the first pin when detecting that the second voltage signal exists in the first pin. Therefore, the current gear can be simply determined through the MCU.
Owner:CHONGQING LANDSHIP INFORMATION TECH CO LTD
Processing method for multi-way electrostatic discharge protection device
ActiveCN103021893BReduce processing difficultyReduce manufacturing costSemiconductor/solid-state device manufacturingConductive materialsSlurry
Owner:SHENZHEN ZSIPAK TECH CO LTD
Electrostatic protection method and device
InactiveCN108829226AGuaranteed manufacturing costDoes not affect structural designVolume/mass flow measurementPower supply for data processingComputer moduleReliability engineering
The embodiment of the invention discloses an electrostatic protection method and device and relates to the technical field of electronic equipment. The problem that in the prior art, when electrostatic protection is carried out on an electrostatic sensitive apparatus of the electronic equipment in a mode of adding an electrostatic protection circuit to the electronic equipment, manufacturing costof the electronic equipment is increased, and structure design of the electronic equipment is influenced to a certain degree is solved. The method provided by the embodiment of the invention comprisesthe steps of obtaining state information of the electronic equipment through a preset sensor; judging whether the electronic equipment is in a silent state or not according to the state information;and carrying out power-cut processing on a target module and / or a target chip if the electronic equipment is in the silent state, wherein the target module is a module comprising the electrostatic sensitive apparatus, and the target chip is a chip comprising the electrostatic sensitive apparatus. The embodiment of the invention is applicable to a process of carrying out the electrostatic protection on the electrostatic sensitive apparatus of the electronic equipment.
Owner:MOBVOI INFORMATION TECH CO LTD
capacitive touch screen
ActiveCN103365521BReduce thicknessSave materialNon-linear opticsInput/output processes for data processingCapacitanceTouch Senses
An embodiment of the present invention discloses a capacitive touch panel, which is provided with an electrostatic protection touching layer, the electrostatic protection touching layer comprises a touching array pattern and an electrostatic protection discharging pattern, and the electrostatic protection discharging pattern is disposed in a space of the touching array pattern, complementing with the touching array pattern. The capacitive touch panel of the embodiment of the present invention, reduces the thickness of touch panel, and saves the material by forming the electrostatic protection layer and the touch sensing layer on one layer, which realizes the touching sense as well as the electrostatic protection, eliminates the capacitance between the electrostatic protection layer and the touch sensing layer, and improves the sensitivity of touching sense.
Owner:BOE TECH GRP CO LTD +1
Seal ring structure and preparation method thereof
ActiveCN112701116BAchieve mechanical protectionAvoid damageTransistorSemiconductor/solid-state device detailsDevice materialEngineering
A sealing ring structure and a preparation method thereof relate to the technical field of integrated circuits. The sealing ring structure includes an enhanced high electron mobility transistor, a diode group and a resistor manufactured through a semiconductor epitaxial layer. On the periphery of the device area; the anode of the diode group is used for metal connection with the first electrode of the semiconductor device, the cathode is metal connected with the first metal end of the resistor, and the second metal end of the resistor is used for metal connection with the second electrode of the semiconductor device; The gate of the type high electron mobility transistor is connected with the cathode metal of the diode group, the drain is used for connecting with the first electrode metal, and the source is used for connecting with the second electrode metal of the semiconductor device. The sealing ring structure can utilize the area of the sealing ring to realize the electrostatic protection function, thereby saving the area of the device.
Owner:HUNAN SANAN SEMICON CO LTD
Display panel and display device
ActiveCN111243429BRealize electrostatic protectionGuaranteed display effectStatic indicating devicesSolid-state devicesComputer hardwareDisplay device
Owner:BOE TECH GRP CO LTD
A kind of embedded chip and its preparation method
ActiveCN111354645BRealize electrostatic protectionSemiconductor/solid-state device detailsSolid-state devicesEngineeringElectric current flow
The invention provides an embedded chip and a preparation method thereof. When the embedded chip is patterned and plated on a circuit board, a conductive closed-loop structure surrounding the chip body inside the circuit board is formed, so that the chip The pin pads of the main body are connected to each other through a conductive closed-loop structure, and then when the chip pins are subsequently formed, the electrostatic current generated by cutting the chip can be dispersed through the conductive closed-loop structure to achieve electrostatic protection for the chip.
Owner:SHENNAN CIRCUITS
Space electrostatic protection solar cell array interconnection packaging structure and method
ActiveCN106549072BRealize electrostatic protectionWith electrostatic dredging functionSemiconductor/solid-state device detailsSolid-state devicesHigh resistanceGlass cover
The present invention discloses a space electrostatic protection solar cell interconnection package structure and a method. The space electrostatic protection solar cell interconnection package structure disclosed by the invention comprises a substrate, solar cells and anti-radiation conductive glass cover sheets; the surface of the substrate is coated with a layer of high-resistance conductive adhesive; the solar cells are bonded onto the surface of the substrate; one missing corner of each solar cell is connected in parallel with a bypass diode; the conductive layers of the anti-radiation conductive glass cover sheets are far away from the solar cells and cover the surfaces of the solar cells; the upper surface, lower surface and corresponding side surfaces of one corner of each anti-radiation conductive glass cover sheet are plated with metal thin films; and the metal thin films are connected in series with the bypass diodes through the high-resistance conductive adhesive. The method of the invention is not only compatible with a traditional solar cell ray assembly process, but also is simple and reliable. With the method adopted, automatic assembly can be realized.
Owner:SHANGHAI INST OF SPACE POWER SOURCES
Microphone electrostatic protection structure and electronic equipment
PendingCN110856063ASave material costThe production process is simpleElectrostatic discharge protectionMouthpiece/microphone attachmentsElectrically conductiveCopper foil
The invention discloses a microphone electrostatic protection structure and electronic equipment, and relates to the field of electrostatic protection, and the microphone electrostatic protection structure is mainly characterized in that a conductive layer is arranged on a sealing element, and the conductive layer is electrically connected with a grounding end on a circuit board to dredge static electricity. Visibly, the static electricity is directly conducted to the grounding end of the circuit board by the conductive layer, so that the static protection of the microphone is realized. Compared with the prior art, copper foils and other conductive materials are not needed, the material cost is saved, the manufacturing process is simplified, and the product cost is reduced. Therefore, themicrophone electrostatic protection structure can carry out electrostatic protection on the microphone, and has the advantages of being simple to manufacture, low in cost and easy to implement. Therefore, the electronic equipment provided with the electrostatic protection structure has good performance.
Owner:GEER TECH CO LTD
A kind of embedded chip and its preparation method
ActiveCN111354702BImprove antistatic performanceRealize electrostatic protectionSemiconductor/solid-state device detailsSolid-state devicesPhysical chemistryMaterials science
The invention provides an embedded chip and a preparation method thereof. The embedded chip includes a circuit board on which electroplated metal is arranged; a chip body located inside the circuit board, and the chip body has a plurality of solder pins a disc, the plurality of pin pads are led out from the electroplated metal to form a plurality of chip pins; and a conductive insert, which is detachably inserted into the plurality of chip pins. By providing the embedded chip with a conductive insert that can be detachably plugged with its chip pins, the chip pins are connected to each other through the conductive insert during the placement and movement of the embedded chip, thereby improving the resistance of the chip. Electrostatic capability, to achieve electrostatic protection of the chip, just remove the conductive plug-in when the embedded chip needs to be used.
Owner:SHENNAN CIRCUITS
Embedded chip and preparation method thereof
ActiveCN111354702AImprove antistatic abilitySimple structureSemiconductor/solid-state device detailsSolid-state devicesEmbedded systemElectrically conductive
The invention provides an embedded chip and a preparation method thereof. The embedded chip comprises a circuit board, a chip body, and a conductive plug-in unit. The circuit board is provided with electroplating metal. The chip body is arranged in the circuit board and is provided with a plurality of pin bonding pads, and the plurality of pin bonding pads are led out by the electroplating metal to form a plurality of chip pins. The conductive plug-in unit is detachably connected with the plurality of chip pins in an inserted manner. The conductive plug-in unit detachably plugged with the chippin of the embedded chip is provided for the embedded chip; in the process of placing, moving and the like of the embedded chip, the chip pins of the embedded chip are mutually conducted through theconductive plug-in unit, so that the anti-static capability of the chip is improved, the electrostatic protection of the chip is realized, and the conductive plug-in unit is detached when the embeddedchip needs to be used.
Owner:SHENNAN CIRCUITS
An electrostatic protection circuit, semiconductor integrated circuit device and electronic equipment
ActiveCN110400799BAvoid destructionRealize electrostatic protectionTransistorSolid-state devicesHemt circuitsControl theory
The invention discloses an electrostatic protection circuit and relates to the technical field of integrated circuit design. The electrostatic protection circuit is applied to an integrated circuit chip. An internal circuit in the integrated circuit chip is connected with a bonding pad end, an internal power supply end and a grounding end. The electrostatic protection circuit comprises: an electrostatic protection circuit; and the input end of the first protection circuit is connected between the internal circuit and the bonding pad end. The output end of a first protection circuit is connected with the internal power supply end. The first protection circuit is used for electrostatic protection between the integrated circuit chip and the internal power supply end. The electrostatic protection circuit has the beneficial effects that ESD current generated between the bonding pad end and the internal power supply end is prevented from damaging the internal circuit, so that electrostatic protection between the integrated circuit chip and the internal power supply end is realized. The invention further provides a semiconductor integrated circuit device and electronic equipment which have the effects.
Owner:GREE ELECTRIC APPLIANCES INC
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