electronic device

Abstract

An electronic device includes a box body, a main board, a first group of electronic components, a second group of electronic components, a first air guide hood, a second air guide hood, a partition, a first suction fan, a second suction fan, and a second suction fan. A blower fan and a second blower fan. The box body includes a bottom case, a top case, a first side case and a second side case. The first side shell and the second side shell form the first air inlet and the second air inlet respectively, the top shell forms the first air outlet and the second air outlet, and the partition plate separates the first group of electronic components and the second group of electronic components. Isolation, the first air guide hood guides the air sucked by the first suction fan to the box body through the first air inlet to the first group of electronic components, and the first blowing fan guides the air to the first group of electronic components through the first group of electronic components. An air outlet blows out of the box, the second air guide hood guides the air sucked by the second suction fan to the box body through the second air inlet to the second group of electronic components, and the second blower fan guides the air to the second group of electronic components. The air of the two groups of electronic components is blown out of the box through the second air outlet.

Description

technical field [0001] The present invention relates to electronic devices. Background technique [0002] In order to enhance the processing performance of the electronic device, there are generally multiple sets of electronic components, such as multiple CPUs and multiple sets of memory modules, on the mainboard in the chassis of the electronic device. Multiple groups of electronic components are usually arranged in series on the motherboard. In order to drive the heat generated by the electronic components to the outside of the chassis, ventilation holes are generally opened on the two opposite shells of the chassis in the serial direction of the electronic components, and the fans are placed at the ventilation holes, and the ventilation holes from one shell are formed by the operation of the fans. Air flow into and out of the ventilation holes of the other case, thereby blowing the heat generated by the electronic components out of the case. Although the above air flow ...

AI Technical Summary

Problems solved by technology

Although the above-mentioned air flow can drive heat to the outside of the chassis, because the air flow passes through one set of electronic components, such as a CPU or a set of memory sticks, before flowing to another set of electronic components, such as another CPU or another set of memory sticks, Therefore, when the air flow reaches another group of electronic components, it has already carried a certain amount of heat, and there is a risk that the heat generated by the other group of electronic components cannot be carried out of the chassis through the air flow, thereby affecting the heat dissipation efficiency of the electronic components

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