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Beam rotator unit and laser processing apparatus

A laser processing and rotator technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problem that there is no taper-free nesting processing, and cannot be obtained.

Inactive Publication Date: 2020-07-07
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, in the method of aligning the focal point with the processing target position of the workpiece, when nesting is performed by scanning a laser beam that is irradiated vertically downward and is the most common method of irradiation, the side surface of the hole It becomes a conical shape, and a straight columnar hole cannot be obtained
[0010] On the other hand, Patent Document 1 discloses a method of making the side surfaces of the concave portion perpendicular to the surface of the workpiece when the workpiece forms a concave portion, but there is no disclosure or suggestion for nesting without a taper.

Method used

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  • Beam rotator unit and laser processing apparatus
  • Beam rotator unit and laser processing apparatus
  • Beam rotator unit and laser processing apparatus

Examples

Experimental program
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Effect test

Embodiment 1

[0063] In this embodiment, an alumina ceramic plate with a thickness of 0.62 mm is drilled with a diameter of 200 μm. The specific processing conditions are as follows.

[0064] Laser conditions→wavelength=532nm, pulse width<50ps, repetition frequency=100kHz, output power=7.5W;

[0065] Speed ​​of beam rotator=10000rpm;

[0066] Z-axis feed pitch = 12μm.

[0067] Figure 5 This is a diagram showing an enlarged image of the through hole obtained by processing. Figure 5 (A) is an image observed from the side of the through hole after cutting the alumina ceramic plate from the cross section through the through hole. Figure 5 (B) is an image of the surface of the alumina ceramic plate after the cutting.

[0068] From Figure 5 It can be confirmed that the taper through hole is well formed.

Embodiment 2

[0070] In this embodiment, a SiC plate with a thickness of 0.36 mm is drilled with a diameter of 300 μm. The specific processing conditions are as follows.

[0071] Laser conditions→wavelength=532nm, pulse width<15ns, repetition frequency=80kHz, output power=4.0W;

[0072] Speed ​​of beam rotator=5000rpm;

[0073] Z-axis feed pitch = 20μm.

[0074] Image 6 This is a diagram showing an enlarged image of the through hole obtained by processing. Image 6 (A) is an image observed from the side of the through hole after the SiC plate is cut from the cross section through the through hole. Image 6 (B) is an image of the surface of the SiC plate after the through hole is formed.

[0075] From Image 6 It can be confirmed that the taper through hole is well formed.

Embodiment 3

[0077] In this embodiment, a Si plate with a thickness of 0.49 mm is drilled with a diameter of 500 μm. The specific processing conditions are as follows.

[0078] Laser conditions→wavelength=532nm, pulse width<15ns, repetition frequency=50kHz, output power=7.5W;

[0079] Speed ​​of beam rotator=5000rpm;

[0080] Z axis feed pitch = 60μm.

[0081] Figure 7 This is a diagram showing an enlarged image of the through hole obtained by processing. Figure 7 (A) is an image observed from the side of the through hole after the Si plate is cut from the cross section through the through hole. Figure 7 (B) is an image of the surface of the Si plate after the through hole is formed.

[0082] From Figure 7 It can be confirmed whether the through hole with taper is well formed

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Abstract

Taper-free machining based on trepanning machining is achieved. In the present invention, a beam rotator, a scanning galvanometer, and an f [theta] lens are provided in this order in the optical pathof laser light from an emission source to an object to be processed. An operation of displacing the laser light such that an irradiation position becomes a scanning trajectory of a closed curve such as a circle by the scanning galvanometer is synchronized with an operation of rotating the irradiation direction while tilting the laser light irradiation direction by the beam rotator and the f [theta] lens. The laser beam is incident on the workpiece at an angle of incidence at which the outermost side of the range through which the laser beam passes is perpendicular to the workpiece.

Description

Technical field [0001] The present invention relates to a device for processing a workpiece using a laser and a beam rotator unit used in the device, and more particularly to a device and a unit for processing a through hole in the workpiece. Background technique [0002] Nesting processing is widely known as a processing method using a laser, which scans a laser beam on a workpiece, for example, in a circular shape, thereby performing a hole processing while leaving a core material. Nesting processing is used to process holes whose opening plane size is larger than the laser beam diameter, or to take out core material whose plane size is larger than the beam diameter. [0003] On the other hand, there is known a technique for forming a concave portion on the surface of a processing object by a laser. This technique uses a laser processing device to control the shape of the concave portion side surface. A pair of optical wedges for the incident angle and an optical wedge for adjus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/082B23K26/064B23K26/70
CPCB23K26/382B23K26/0821B23K26/0648B23K26/064B23K26/702B23K26/04B23K26/36
Inventor 林尚久佐岛德武前田宪一栗山规由熊谷透清水政二
Owner MITSUBOSHI DIAMOND IND CO LTD
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