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Glass laser cutting equipment and production process thereof

A radium cutting and equipment technology, applied in welding equipment, laser welding equipment, metal processing equipment and other directions, can solve the problems of product quality decline and thinning of product raw materials.

Inactive Publication Date: 2021-02-19
大昶(重庆)电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a radium cutting equipment for glass to solve the problem in the prior art that after laser engraving, it is necessary to use liquid medicine to corrode the slivers and other processes, so as to reduce the thickness of the raw material of the product and cause the quality of the product to decline.

Method used

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  • Glass laser cutting equipment and production process thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Basic as attached figure 1 Shown: a radium cutting equipment for glass, including a working platform 1, a laser emitter 2, a slide rail module and a control system, the laser emitter 2 is fixed on the working platform 1, and the laser emitter 2 is provided with a laser head 3 , the laser head 3 is set downwards. In this embodiment, the laser emitter 2 is a femtosecond laser. The slide rail module is arranged on the working platform 1 and is located below the laser head 3. The control system is used to control the movement of the slide rail module. move.

[0032] In this embodiment, the slide rail module includes a fixed slide rail 4 and a moving slide rail 5, and a Y-axis module 6 is slidably connected to the fixed slide rail 4. The Y-axis module 6 includes a slider 7, and the top of the slider 7 is provided with a There is a chute, and the chute and the fixed slide rail 4 are arranged perpendicular to each other. The X-axis module 8 is slidably connected to the moving...

Embodiment 2

[0039] The difference from Embodiment 1 is that there are two moving slide rails 5, and each of the moving slide rails 5 is provided with an X-axis module 8, and the X-axis module 8 is slidably connected with the chute on the top of the slider 7 , the two X-axis modules 8 are respectively fixed with substrates 9 , the glass panel is placed on the two substrates 9 , and the opening area of ​​the glass panel is located between the two substrates 9 .

[0040] A guide plate is provided between the two X-axis modules 8, and the guide plate is inclined. In addition, a discharge port is provided on the working platform 1, and the lower end of the guide plate faces the discharge port, and the work platform 1 There is also a recovery frame located directly below the discharge port, so that after opening the glass panel, the blanking material slides directly down the guide plate and enters the recovery frame through the discharge port without manual collection.

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Abstract

The invention relates to the technical field of glass laser etching, and particularly discloses glass laser cutting equipment. The glass laser cutting equipment comprises a working platform, a laser emitter, a sliding rail module and a control system, wherein the laser emitter is fixed to the working platform, the sliding rail module is located below the laser emitter, the control system is used for controlling movement of the sliding rail module, the laser emitter is a femtosecond emitter, the generated wavelength is not lower than 1030 nm, and the pulse width does not exceed 400. The equipment is provided with the high-energy femtosecond laser, thereby being capable of directly puncturing glass without applying any mechanical force in the process, performing tapping treatment on a tempered glass panel, and improving the tapping precision; and certainly, the equipment can also perform tapping treatment on a glass panel which is not tempered, the procedure is simplified, and productivity is greatly improved.

Description

technical field [0001] The invention relates to the technical field of laser engraving on glass, in particular to a radium cutting device for glass. Background technique [0002] Flat glass has been widely used in the screens or panels of various laptops, mobile phones, and other portable digital devices, and some glass products need to be drilled during processing. The conventional cutting method is to use a diamond knife, a drill Scribe the surface of the glass panel with tools such as knives or grinding wheels, and then use mechanical stress to pull the glass panel apart. Glass chips and dust generated at the edge of the panel during the scribing process will adhere to the panel, causing other parts of the panel to scars. [0003] Based on the above problems, there has been a process of opening holes using laser technology. Since the currently disclosed laser sources are usually long-wave infrared lasers, due to the long wavelength, laser engraving can only be carried ou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/142B23K26/70
CPCB23K26/38B23K26/142B23K26/702B23K2103/54
Inventor 何绍伦
Owner 大昶(重庆)电子科技有限公司
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