Copper foil manufacturing device for microporous copper foil

Abstract

The invention discloses a copper foil manufacturing device for microporous copper foils, which comprises a workbench, a microporous copper foil cathode manufacturing mechanism and a microporous copper foil anode manufacturing mechanism are arranged at the top end of the workbench, and the microporous copper foil anode manufacturing mechanism is positioned below the microporous copper foil cathode manufacturing mechanism and is arranged corresponding to the microporous copper foil cathode manufacturing mechanism. Supporting legs are fixedly connected to the four corners of the bottom end of the workbench, a power source is fixedly connected to any supporting leg, the micropore copper foil anode manufacturing mechanism communicates with the positive electrode of the power source, the micropore copper foil cathode manufacturing mechanism communicates with the negative electrode of the power source, and a micropore copper foil winding mechanism is arranged on the workbench. And the microporous copper foil winding mechanism and the microporous copper foil cathode manufacturing mechanism are correspondingly arranged. In the preparation process of the electrolytic copper foil, trepanning treatment on the copper foil is achieved, the copper foil product with micropores is directly prepared, the processing steps are simplified, the manufacturing efficiency of the micropore copper foil is improved, the manufacturing cost is saved, and application and popularization are facilitated.

Description

technical field [0001] The invention relates to the technical field of copper foil manufacturing, in particular to a copper foil manufacturing device for microporous copper foil. Background technique [0002] Copper foil is made of copper plus a certain proportion of other metals. It is a kind of negative electrolytic material. It is a thin and continuous metal foil deposited on the base layer of the circuit board. It is easy to stick as a conductor of the PCB. It is suitable for the insulating layer, accepts the printed protective layer, and forms a circuit pattern after etching. With low surface oxygen characteristics, it can be attached to various substrates, such as metals, insulating materials, etc., and has a wide temperature range. Mainly used in electromagnetic shielding and antistatic, the conductive copper foil is placed on the substrate surface, combined with the metal substrate, it has excellent conductivity, and provides the effect of electromagnetic shielding....

AI Technical Summary

Problems solved by technology

However, the microporous copper foil in the prior art is mostly extruded or laser perforated on the finished copper foil, the process is complicated and costly, and at the same time, due to factors such as the material of the copper foil itself and the small aperture, it is easy to cause inconsistent apertures and affect Subsequent use of the product

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