Double-sided plastic packaging mold and one-step double-sided plastic packaging method
A plastic sealing mold, double-sided technology, applied in the secondary processing of printed circuits, electrical components, printed circuits, etc., can solve problems such as deformation, glue overflow in non-plastic sealing areas, etc.
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Embodiment 1
[0035] Such as figure 2 A double-sided plastic encapsulation mold is shown, which is used for such as Figure 1a The primary plastic sealing of the double-sided PCB board 30 includes an upper mold 10 and a matching lower mold 20, and the outer edges of the upper mold 10 and the lower mold 20 are pressed together. groove 11, the lower mold 20 is provided with a second groove 23, when the upper mold 10 and the lower mold 20 are closed, a first mold is formed between the first groove 11 and the area 31 to be packaged on the first surface of the PCB 30. Cavity, the second mold cavity is formed between the second groove 23 and the area 32 to be packaged on the second surface of the PCB board 30, and the outer edge contours of the upper mold 10 and the lower mold 20 are consistent to ensure that the upper mold 10 and the lower mold 20 When closing the molds, the positions where the upper mold 10 and the lower mold 20 press the PCB board 30 are corresponding, so as to ensure that t...
Embodiment 2
[0037] Such as Figure 1b with Figure 1c As shown, on the basis of the first embodiment, the second surface of the PCB board 30 also includes a non-encapsulation area 33 . The shape of the non-encapsulation area 33 of the PCB board 30 is designed according to the actual situation, which can be square, triangular, etc., and should be based on the premise of reducing the difficulty of making the mold. It can be seen from the figure that the first to-be-molded area 31 on the first surface of the PCB 30 and the to-be-molded area 32 on the second surface of the PCB 30 are asymmetrical due to the existence of the non-encapsulation area 33 . During the plastic sealing process, since the non-encapsulation area 33 has no pressing surface, the upper and lower pressing surfaces of the PCB board 30 are asymmetrical, and the pressure on the two sides of the PCB board 30 with the non-encapsulation area is inconsistent, causing the board surface to bend. The plastic sealant 40 will enter t...
Embodiment 3
[0041] During the plastic sealing process, the PCB board 30 will be deformed due to the inconsistent pressure on the upper and lower board surfaces, so that the PCB board 30 will be separated from the suction part 21 . Therefore, in this embodiment, on the basis of the second embodiment, several vacuum holes 22 are also provided on the suction part 21. The vacuum holes 22 extend upward from the outer surface of the lower mold 20 to the surface of the suction part 21, and are connected with the suction part 21. The surface of the joint part 21 is vertically arranged, and the upper opening of the vacuum hole 22 is flush with the surface of the suction part 21, so that the non-plastic sealing area of the PCB board 30 is close to the surface of the suction part 21 during plastic sealing; The vacuum makes the non-plastic-encapsulated area of the PCB board 30 closely adhere to the suction part 21 .
[0042] In an embodiment of the present invention, the opening of the vacuum hol...
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