Encapsulation construction of ball lattice array for preventing glue overflow
An array packaging and construction technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of general products without structure and inconvenience, and achieve the effect of improving glue overflow and increasing adhesion
Inactive Publication Date: 2009-05-20
POWERTECH TECHNOLOGY INC
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Problems solved by technology
[0009] It can be seen that the above-mentioned existing ball grid array packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve
Method used
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[0084] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation and structure of the ball grid array packaging structure for preventing glue overflow proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , features and their effects are described in detail below.
[0085] see image 3 and Figure 7 As shown, according to the first specific embodiment of the present invention, a ball grid array package structure is disclosed. image 3 is a schematic cross-sectional view of the ball grid array package structure cut across the slot. Figure 4 is a schematic cross-sectional view of the ball grid array package configuration in the neck. Figure 5 It is a schematic diagram of the lower surface of the substrate constructed for the ball grid array package after die bonding and before encapsul...
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The invention relates to a ball grid array package structurewhich can preventglue from overflowing. The invention comprises a base platewhich is provided with an upper surface, a lower surface and at least one slotopening; a waferwhich is arranged on the upper surface of the base plate, and is also provided with a plurality of bonding pads aiming at the inner part of the slot opening; a plurality of bonding wires which electrically connect the bonding pads with the base plate through the slot opening; a potting colloid, which is provided with a square-shaped body and at least one bar-shaped body, the square-shaped body is formed on the upper surface of the base plate to seal the wafer, the bar-shaped body is formed in the slot opening and a part of the lower surface of the base plate to seal the bonding wires; a plurality of solder balls, which are arranged on the lower surface of the base plate, wherein, a necking is formed and arranged at a section of the slot opening on the base plate, and the necking is narrower than the average width of the slot, to slow down the flow speed of pouring the potting colloid at the slot opening, therefore, the invention can effectively promote the sealing degree of thelower surface and the lower die of the base plate by the genarated upper and lower mold flow pressure difference, and the problem of glue overflowing when which is being poured is fully improved.
Description
technical field [0001] The present invention relates to a ball grid array packaging structure, in particular to a window type ball grid array packaging structure (BALL GRID ARRAY PACKAGE FOR PREVENTING MOLDFLASH) which can prevent glue overflow. Background technique [0002] The ball grid array packaging structure can use a molding compound as a sealing protection for the chip. The existing known method of forming the molding compound is to place the substrate on which the chip has been pasted on the upper and lower molds for compression molding. In between, the precursor to form the molding compound is re-injected to seal the wafer. However, in the process of sealing the glue, because the substrate and the lower mold cannot be tightly bonded, the glue overflows easily, which makes the ball pads polluted and affects the solderability and electrical quality. [0003] see figure 1 Shown is a schematic cross-sectional view of a conventional ball grid array package structure. ...
Claims
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IPC IPC(8): H01L23/31H01L23/488H01L23/498
CPCH01L2924/15311H01L2224/4824H01L2224/48091H01L2224/73215H01L2224/32225H01L2924/181H01L2924/18165
Inventor 范文正黄欣慧
Owner POWERTECH TECHNOLOGY INC