Glue sealing structure for organic electroluminescent planar display device and production thereof

Abstract

The sealant structure consists of glass baseboard, closing cap adhesive layer and blockage region. There is a luminous display structure and an organic luminescence structure covering the luminous display structure above formed on the glass baseboard. The closing cap and the glass baseboard are sealed together. The adhesive layer is located between the glass baseboard and the closing cap. The blockage region is formed on the glass baseboard, and sits beside one side of the adhesive layer to prevent internal structure from overflow of adhesive from the adhesive layer.

Description

technical field [0001] The present invention relates to an organic electroluminescent flat panel display (Organic Electroluminescent Display Panel), in particular to an organic electroluminescent flat panel display with a low-impedance external sealing wire. Background technique [0002] Organic electroluminescence is to vapor-deposit a variety of organic materials into films on the glass substrate coated with ITO film by vacuum thermal evaporation, and then form a metal film as the cathode on the organic layer. Next, in order to prevent external water vapor from deteriorating the life of the organic electroluminescent element, the cover with the desiccant is tightly bonded to the glass substrate with a UV adhesive to prevent water vapor from intruding. The technical characteristics of organic electroluminescence include: self-illumination, DC low-voltage drive (below 10V), high luminous efficiency, low power, rich luminous colors, easy to achieve color display, simple proce...

AI Technical Summary

Problems solved by technology

Among them, the bonding resin that prevents moisture intrusion generally meets the mass production conditions of low temperature and short-term hardening, and most of them use UV epoxy resin with low moisture permeability. This affects the long-term life of the component

In addition, when sealing and pressing, there are still problems such as UV resin 3a easily overflowing to the surface of the component and bonding with the rear module, thereby affecting the electrical properties of the external wires; The glue situation and glue overflow area cannot be controlled. Therefore, the production status of the glue sealing area and the glue sealing height cannot be conditionalized, which is not conducive to the process of mass production

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