Chip attaching method and camera module

Abstract

The invention discloses a chip attaching method and a camera module, and the chip attaching method comprises the steps: providing a chip and a DAF film, and attaching the DAF film to the chip; providing a PCB, and laminating the chip with the PCB through the DAF film; and baking the laminated chip, the DAF film and the PCB together, wherein the baking temperature is 100 DEG C to 150 DEG C. A DAF thermosetting adhesive film is firstly attached to the bottom of the chip, and then the chip attached with the DAF film is bonded with the PCB, so that the adhesive drawing action does not need to be carried out in the attaching process, the problems of adhesive breaking, adhesive shortage and adhesive overflowing are effectively solved, the problem of chip inclination caused by non-uniform adhesive in the baking process is effectively solved, and the product test yield is improved.

Description

technical field [0001] The invention relates to the technical field of plastic encapsulation of camera modules, in particular to a chip attaching method and a camera module. Background technique [0002] In the prior art, a camera module includes multiple components, such as a substrate, a chip, a lens, a motor, and the like. During the plastic sealing process of the camera module, the chip of the camera module is first attached to the substrate, and then the solder joints of the chip are connected to the solder joints on the substrate, and then the chip, the substrate and the components on the substrate are plastic-sealed. Since the surface of the substrate, such as a printed circuit board (Printed Circuit Board, PCB) is an area with ink and exposed copper, the flatness after baking is poor, which causes the chip to be tilted relative to the horizontal plane when it is pasted on the substrate, thereby causing the gap between the chip and the lens. The inclination angle cau...

AI Technical Summary

Problems solved by technology

Since the surface of the substrate, such as a printed circuit board (PCB), has ink and exposed copper areas, the flatness after baking is poor, causing the chip to be inclined relative to the horizontal plane when it is pasted on the substrate, and there is a gap between the chip and the lens. The angle of inclination causes the image of the camera module to be blurred. It can be seen that when the existing camera module is assembled, when the chip is fixed on the substrate, the technical problem of inclination is prone to occur.

[0003] The existing chip attachment process is to use epoxy resin glue to bond the chip and PCB together. The use time of the glue is limited to 36 hours under normal temperature conditions. The glue must be scrapped if it exceeds the effective use time, causing unnecessary waste; In addition, glue breakage, glue shortage and glue overflow are prone to occur during the production process. Little glue and glue breakage will lead to weak chip adhesion and affect quality. Overflow glue will cause chip pollution and golden finger pollution, leading to the scrapping of the entire product.

The unevenness of the glue and glue will easily cause the tilt to exceed the control specification range during the baking and curing process, which will affect the quality of the product test; and the warping degree of the chip during the baking and curing process is uncontrollable, and the warping degree of the chip is not the same, resulting in product failure. different performance

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