Temperature measurement connector, temperature measurement carrier plate and temperature measurement system

Abstract

The invention discloses a temperature measurement connector, a temperature measurement carrier plate and a temperature measurement system. The temperature measurement connector comprises a telescopicsealing structure, a first lead connector and a plurality of first leads, wherein the telescopic sealing structure is used for penetrating through a sealed cavity needing temperature measurement and is movably connected with the cavity in a sealed mode; the first lead connector is arranged at one end in the cavity of the telescopic sealing structure, and a plurality of first contact terminals arearranged on the first lead connector; the plurality of first leads are respectively arranged in the telescopic sealing structure, and the plurality of first leads are respectively and electrically connected with the corresponding first contact terminals; and the telescopic sealing structure can drive the first lead connector to move along the cavity so as to enable each first contact terminal to be electrically connected with or separated from a corresponding second contact terminal on a second lead connector on the temperature measurement carrier plate. The temperature measurement connector adopts a split type lead connection structure, so that the structure of the temperature measurement system can be simplified. The temperature measurement mode that a temperature sensor is directly embedded in a carrier plate body is adopted, and the accuracy of temperature measurement can be improved.

Description

Technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a temperature measurement connector, a temperature measurement carrier board and a temperature measurement system. Background technique [0002] Generally, semiconductor processing equipment, for example, Metal-organic Chemical Vapor Deposition (MOCVD) equipment, during operation, the temperature of the carrier in the chamber can be as high as 900 ℃, and usually requires a non-contact type The infrared high temperature sensor measures the temperature of the carrier board. The temperature measurement principle of the infrared high temperature sensor is that the probe of the infrared high temperature sensor indirectly measures its temperature by receiving the radiation light of the carrier board. [0003] However, when the semiconductor processing equipment is restricted by insufficient internal space or complicated operating conditions, the infrared high temperature senso...

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Problems solved by technology

[0003] However, when semiconductor processing equipment is limited by conditions such as insufficient internal space or complex operating conditions, the infrared high temperature sensor must be installed on the same side as the heating lamp, and the probe of the infrared high temperature sensor will wear out when measuring the temperature at the bottom of the substrate Overheating the gap of the lamp tube, so that when measuring the temperature, the probe will receive the stray light from other objects such as the heating lamp tube in addition to the radiated light at the bottom of the carrier board, which will cause uncontrollable interference and cause the measured temperature to be inconsistent. allow

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