Modular negative-pressure heat dissipation device for computer

Abstract

The invention relates to the technical field of computer cases, in particular to a modular negative-pressure cooling device for a computer. The device comprises a mainframe box and an electric coolingfan, and lateral loading and unloading ports are formed in the front side wall and the rear side wall of the mainframe box. According to the modular negative-pressure heat dissipation device for thecomputer, the transverse lateral negative-pressure pipe communicating with the interior of the annular assembly box is fixed to the inner side face of the lateral sealing cover plate; external air ispumped into the transversely-arranged lateral negative pressure pipe through an electric cooling fan in the annular assembling box. A module mounting opening with a built-in elastic sealing plate is formed in the outer side surface of the transverse lateral negative pressure pipe, the modular lateral air guide pipe is inserted into the module mounting opening to bend the elastic sealing plate, sonegative pressure is formed at the module mounting opening, the modular lateral air guide pipe is used for quickly pumping away heat in the case, and the heat dissipation efficiency is greatly improved; by adopting modular installation, the adjustment operation is simple, and the adjustment range is wider.

Description

technical field [0001] The invention relates to the technical field of computer case, in particular to a modularized negative pressure cooling device for computers. Background technique [0002] High temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. At present, most of the heat dissipation devices used in computers are simple in structure. They are directly fixed on the inner wall of the chassis or outside the electronic components to quickly conduct heat. limited. Contents of the invention [0003] The technical problem to be solved by the present invention is: in order to solve the problems existing in the above-mentioned background technology, an improved modularized neg...

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to solve the problems existing in the above-mentioned background technology, an improved modularized negative pressure cooling device for computers is provided, which solves the problem that most of the cooling devices currently used in computers are simple in structure. Rapid heat conduction is carried out on the inner wall of the chassis or outside the electronic components. This heat dissipation method has a fixed position, and the positions of the heat extraction port and the heat dissipation port are fixed and cannot be adjusted, resulting in a problem that the heat dissipation method is very limited.

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