Production method of embedded circuit board

Abstract

The invention discloses a production method of an embedded circuit board. The method comprises the following steps: arranging a first metal layer on a core board, wherein the core board includes a base material board and a second metal layer covering the base material board, and the first metal layer is arranged on the second metal layer; forming a first circuit layer on the first metal layer, wherein the first circuit layer includes at least one first circuit; laminating a prepreg on the first circuit layer so as to embed a circuit on the first circuit layer into the prepreg; and separating the first metal layer from the second metal layer, and etching the first metal layer to expose the first circuit layer embedded in the prepreg. The scheme can be used to improve circuit density, reducecrosstalk between circuits, decrease an etching amount of the circuits and so on.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a method for preparing an embedded circuit board. Background technique [0002] With the requirements of more and more functions and thinner and shorter electronic products, there are more and more lines on the circuit boards in the electronic products, and the size of the circuit boards is also becoming smaller and smaller. [0003] Setting more lines on a circuit board with reduced size will inevitably result in a smaller line width of the lines or a narrower distance between the lines. Lines with too small line width are likely to be detached from the circuit board due to insufficient adhesion, while too narrow line spacing will cause crosstalk between lines, and too narrow spacing will cause the edges of the lines to be easily etched during the etching process, further shrinking the line. Wide, in this way, will lead to failure of electronic products, making the reliability of e...

AI Technical Summary

Problems solved by technology

[0003] Setting more lines on a circuit board with reduced size will inevitably result in a smaller line width or a narrower distance between lines

Circuits with too small line width are likely to be detached from the circuit board due to insufficient adhesion, and crosstalk between lines will occur if the line spacing is too narrow, and too narrow spacing will cause the edges of the lines to be easily etched during the etching process, further shrinking the line. Wide, in this way, it will lead to the failure of electronic products, which will reduce the reliability of electronic products

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