Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Integrated electronic switch

A technology of integrated electronics and power switches, applied in the direction of electric switches, circuits, electrical components, etc., can solve the problems of occupying the internal space of integrated electronic switches, affecting product performance, and poor heat dissipation effect, so as to improve heat dissipation effect and use performance , Improve the effect of thermal conductivity

Pending Publication Date: 2020-07-28
KEDU ELECTRIC CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the multiple heat sinks in the prior art that not only occupy the internal space of the integrated electronic switch, but also have a small heat dissipation area, which has a poor heat dissipation effect on the circuit board and the power switch, and affects In order to solve the problem of product performance, it provides an integrated electronic switch with a large heat dissipation area and improved heat dissipation effect on circuit boards and power switches

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated electronic switch
  • Integrated electronic switch
  • Integrated electronic switch

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Below in conjunction with accompanying drawing this embodiment is described in detail:

[0050] This embodiment provides as Figure 1-11 The shown integrated electronic switch includes a housing 1, a cover 2 mounted on the housing, a mechanical system and a PCB board component 3, and the mechanical system is accommodated in the housing 1 and snapped together with the cover 2 In the closed cavity 11 formed, and is movably connected with the PCB3 board, the housing 1 has an open cavity 12 set relative to the closed cavity, and the PCB board component 3 includes The first part 31 of the cavity, and the second part 32 accommodated in the open cavity, the second part 32 is provided with a power switch assembly 4 for switching and controlling the power supply of the motor; the bottom of the housing 1 corresponds to the The second part is provided with a heat dissipation structure 5 for dissipating heat from the PCB board component and the power switch assembly, and the heat ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an integrated electronic switch. The integrated electronic switch comprises a sealing cover, a mechanical system and a PCB component which are installed on a shell, wherein themechanical system is accommodated in a closed cavity formed by buckling the shell and the sealing cover, the PCB component comprises a first part accommodated in the closed cavity, and a second partaccommodated in the open cavity of the shell, a power switch assembly is arranged on the second part, the bottom of the shell is provided with a heat dissipation structure which can be directly or indirectly in thermal connection with the PCB component and the power switch assembly. The integrated electronic switch is advantaged in that heat generated by the PCB component and the power switch assembly is conducted out from the bottom of the shell through the heat dissipation structure, the heat dissipation effect on the PCB component and the power switch assembly is achieved, moreover, the internal space of the open cavity of the shell is not occupied, the bottom of the shell is wider, installation is convenient, the area of the heat dissipation structure can be large enough, and thereforethe heat dissipation effect on the PCB component and the power switch assembly is improved.

Description

technical field [0001] The invention relates to the technical field of power switches, in particular to an integrated electronic switch. Background technique [0002] The integrated electronic switch is a switch that integrates the mechanical part of the switch and the circuit control system to control the work of electric tools. Common electric tools include electric drills, electric grinders, electric wrenches, electric hammers, impact drills, and concrete vibrators. , electric planer, etc., through the integrated control switch, the motor start, stop and speed or steering adjustment of the electric tool can be realized. [0003] The existing integrated electronic switch mainly includes a housing, a mechanism casing, an operating mechanism, a contact mechanism, a circuit board, a control circuit, etc. The operating mechanism and the contact mechanism are installed in the installation space formed by the assembly of the casing and the mechanism casing. The circuit board ha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01H9/52H01H9/04H01H9/54H01H3/38H01H3/32H02P29/00
CPCH01H3/32H01H3/38H01H9/04H01H9/52H01H9/54H02P29/00
Inventor 郑春开
Owner KEDU ELECTRIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products