Feeding mechanism used for coupling of multi-path single-mode COB module lenses

Abstract

The invention provides a feeding mechanism used for coupling of multi-path single-mode COB module lenses. The feeding mechanism comprises a lens feed assembly and a lens clamp assembly. The lens feedassembly is mainly composed of a loading case and a material stirring structure. A loading trough where the lenses are loaded is formed on the one side of the loading case, the lenses are placed in the loading trough side by side and are limited in the loading trough through a limiting structure arranged on the loading case, and therefore the lenses are prevented from moving out from the side faceof the loading trough. The material stirring structure comprises a material stirring block and a material stirring block drive portion driving the material stirring block to move, the material stirring block is inserted into the loading trough and stirs out the lenses from the top end of the loading case to the upper portion in sequence, and the lens clamp assembly clamps and moves the stirred-out lenses to the corresponding coupling positions to be coupled. The feeding mechanism is suitable for feeding operation of micro lenses, and feeding efficiency is effectively improved; and meanwhile,through an inner trough arranged in the loading trough, inner arc faces arranged on lens clamping jaws and the like, the situation that the phenomena of friction, colliding and the like happen in theprocess of feeding the plane parts of the lenses, and damage is caused can be avoided.

Description

technical field [0001] The invention relates to the technical field of COB, in particular to a feeding mechanism for lens coupling of multi-channel single-mode COB modules. Background technique [0002] COB (Chip-on-Board), also known as direct chip mounting technology, refers to the method of directly pasting bare chips on the printed circuit board PCB, then performing wire bonding, and then using organic glue to protect the chip and leads. craft. Compared with the traditional process, COB has the following advantages: eliminates the requirement for wire bonding connection, increases the connection density, and makes the product performance more stable and reliable; eliminates the link pins between the chip and the application circuit board, and improves the product reliability. Integration; it can be bonded and mounted on both sides of the PCB, correspondingly reducing the size of the application module and expanding the application space of the COB module; stronger ease ...

AI Technical Summary

Problems solved by technology

Therefore, the accuracy of lens coupling and the quality of dispensing and curing significantly affect the packaging quality of COB modules

At the same time, there are many packaging points for the lens on the PCB, and the size of the lens is too small, which makes the storage, loading and coupling process of the lens more sophisticated and complicated, and it is difficult to meet the packaging process of the above-mentioned COB module by using conventional coupling equipment. Require

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