High-yield die casting alloy material suitable for use in mobile phone medium plate and preparation method of high-yield die casting alloy material

A die-casting alloy and high-yield technology, which is applied in the field of aluminum alloys, can solve problems such as the complex structure of the middle plate of mobile phones, and achieve the effects of increasing yield strength, increasing elongation, and refining recrystallized grains

Inactive Publication Date: 2020-08-04
苏州慧驰轻合金精密成型科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First of all, the structure of the middle plate of the mobile phone is more complicated. The ordinary stamped aluminum strip can no longer meet its design requirements. The die-casting and molding methods can deal with the complex structure inside the mobile phone and can form ultra-thin and high-strength mobile phone structural components. However, the traditional The yield strength can only

Method used

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  • High-yield die casting alloy material suitable for use in mobile phone medium plate and preparation method of high-yield die casting alloy material
  • High-yield die casting alloy material suitable for use in mobile phone medium plate and preparation method of high-yield die casting alloy material

Examples

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Effect test

Embodiment 1-8

[0031] A thin-walled die-casting aluminum alloy with high strength and high thermal conductivity, comprising the components in mass percentages listed in Table 1 below, and the balance being aluminum and unavoidable impurities.

[0032] Si: 11.0wt%-15.0wt%; Mg: 1.0wt%-2.0wt%; Fe: 0.1-0.5%; Mn: 0.2wt%-0.8wt%; Ce: <0.5wt%; Zr: 0.01wt%- 0.5wt%, Cu: <0.15%,

[0033] Table 1 is the content table of each element in the aluminum alloy of Examples 1-8 and the performance table of the middle plate of the mobile phone prepared therefrom

[0034]

[0035] The preparation method of aluminum alloy described in above-mentioned each embodiment is:

[0036] 1) Calculate the quality of the required master alloy according to the ratio, and prepare materials;

[0037] 2) Put the high-purity aluminum element into the heating furnace, heat it to 600°C, completely melt and keep it for 15 minutes;

[0038] 3) Raise the temperature to 650°C, and add Si and Mn elemental elements; the Si and Mn a...

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Abstract

The present invention relates to a high-yield die casting alloy material suitable for use in a mobile phone medium plate and a preparation method of the high-yield die casting alloy material. The alloy comprises the following components of, 11.0 wt%-15.0 wt% of Si, 1.0 wt%-2.0 wt% of Mg, 0.1%-0.5% of Fe, 0.2 wt%-0.8 wt% of Mn, less than 0.5 wt% of Ce, 0.01 wt%-0.5 wt% of Zr, less than 0.15 wt% ofCu, less than 0.01 wt% of rest of impurities, and the balance of Al. compared to the prior art, the preparation method significantly improves the yield strength and elongation of the material by adding Mn, Si, Mg and Ce to the aluminum alloy and introducing three strengthening phases Mg2Si, MnAl6 and Al11Ce3 binary precipitated phase.

Description

technical field [0001] The invention relates to an aluminum alloy, in particular to a high-yield die-casting alloy material suitable for a middle plate of a mobile phone and a preparation method thereof. Background technique [0002] The mobile phone mid-board refers to the substrate inside the high-end smartphone, which is mainly used to support the internal circuit board of the mobile phone and dissipate the heat generated by the internal chips and lines of the mobile phone in time. Its thickness is generally thin, about 0.5mm. The performance of the middle board of the mobile phone requires the material to have high strength to ensure the strength required for it to support the circuit board; the material is required to have excellent thermal conductivity so that the internal temperature can be transferred to the edge in time and released in time; The material is required to have excellent forming performance, so as to facilitate stamping and small-angle bending, and ensu...

Claims

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Application Information

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IPC IPC(8): C22C21/02C22C1/03
CPCC22C1/026C22C1/03C22C21/02
Inventor 汪时宜周银鹏陈曦屈雪莲罗云斌赵华
Owner 苏州慧驰轻合金精密成型科技有限公司
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