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Semi-conductor wafers longer than industry standard square

An industry standard, semiconductor technology, used in semiconductor devices, semiconductor/solid-state device manufacturing, sustainable manufacturing/processing, etc., and can solve problems such as expensive

Pending Publication Date: 2020-08-07
1366 TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, given the geometrical constraints of wafer formation that produce square wafers, and given that the industry has invested heavily in processing equipment that can accommodate these nominally 156mm x 156mm (but actually now 157mm x 157mm) square wafers, any A module maker trying to use wafers larger than the standard upper limit of 157mm x 157mm would be very expensive

Method used

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  • Semi-conductor wafers longer than industry standard square
  • Semi-conductor wafers longer than industry standard square
  • Semi-conductor wafers longer than industry standard square

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Embodiment Construction

[0075] Some processing schemes and architectures are in the method entitled Methods For Efficiently Making ThinSemiconductor Bodies From Molten Material For Solar Cells and the Like (for Solar Cells and the Like) assigned to 1366 Technologies Inc. by the inventor Emanuel M. Methods for Efficiently Fabricating Thin Semiconductors from Molten Materials for Batteries, etc.) U.S. Patent No. 8,293,009B2 and related additional patents, including U.S. Patent No. 8,696,810 issued April 15, 2014 and U.S. Patent No. 9,643,342 issued May 9, 2017. The disclosures of the above-mentioned patents are hereby fully incorporated herein by reference. The techniques disclosed in the patents cited above are collectively referred to herein as direct wafer (DW) techniques.

[0076] Aspects of the invention disclosed herein relate to having an industry standard size along one dimension (referred to herein as width w) and being longer along a dimension perpendicular to the standard size width (referr...

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Abstract

A semiconductor wafer is as wide as the industry standard width A (presently 156 mm + / - 1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with aperpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.

Description

[0001] Cross References to Related Applications [0002] The application claims the title of SEMI-CONDUCTOR WAFERS FOR USE INSOLAR CELLS AND MODULES THAT ARE LONGER THAN SIZE OF A SIDE OF THE INDUSTRYSTANDARD SQUARE, AND METHODS OF MAKING AND USING SAME AND SOLAR CELLS ANDMODULES INCORP filed on October 24, 2017 U.S. provisional number 62 / 576,143 for SAME (Semiconductor Wafers with Side Dimensions Longer Than Industry Standard Square for Use in Solar Cells and Modules, and Methods of Making and Using The Same and Solar Cells and Modules Incorporating The Same) priority of the application, the entire disclosure of which is hereby incorporated by reference in its entirety. Background technique [0003] Wafers for solar cells and solar modules are generally square. They are manufactured in a square shape, trimmed to final size, and used in that shape. Alternatively, in some cases, they are fabricated in a square shape and then cut into smaller units arranged in such a way that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/78H01L21/67H01L21/683B25B11/00
CPCH01L21/67313H01L21/6734H01L21/67706H01L31/042H01L31/035281H01L31/1804H01L31/1876Y02E10/547Y02P70/50H01L21/67353H01L21/67373B65G47/90
Inventor R.A.斯蒂曼
Owner 1366 TECH INC