A high-efficiency thermal insulation exhaust manifold
A thermal insulation and exhaust manifold technology, applied in the direction of exhaust devices, machines/engines, layered products, etc., can solve the problems of lifespan reduction, mechanical performance degradation, thermal insulation effect failure, etc., to prevent direct heating damage, The effect of not being directly radiated
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0021] like figure 1 , 2 The shown exhaust manifold with high efficiency heat preservation and heat insulation includes a linear manifold segment 1 , an installation shell 2 that is fastened up and down opposite to the outer side of the manifold segment 1 , and an insulating block arranged on the outer side of the installation shell 2 . The outer surface of the installation shell 2 is radially extended with installation columns 21. The installation columns 21 are arranged at linear intervals along the axis of the manifold section 1 and are arranged in a plurality of circumferential arrays that are evenly distributed around the axis of the manifold section 1. The cylindrical circumferential array structure realizes the convenient and complete installation effect of installing the insulation blocks in a modular manner. In this embodiment, there are four installation columns 21 and insulation blocks a week. The installation shell 2 and the installation column 21 in this embodime...
Embodiment 2
[0031] The technical scheme described in embodiment two is similar to embodiment one, and its difference is:
[0032] The connection part 314 in the second embodiment is a zigzag shape extending along the radial direction of the manifold segment 1 (that is, the extension direction is perpendicular to the connection part 314 in the first embodiment), so that when the installation is performed to enclose the manifold segment 314 Easier.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

