Ultrahigh-speed mounting head and chip mounter

A placement head, ultra-high-speed technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of low cost performance and high production cost of placement machines, and achieve the effect of increasing placement speed

Active Publication Date: 2020-08-18
方强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to break through the speed bottleneck of the placement machine, it is mainly achieved by increasing the number of placement heads or increasing the number of suction nozzles on each placement head, which makes the production cost of the placement machine more and more high, and the cost performance is not high.

Method used

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  • Ultrahigh-speed mounting head and chip mounter
  • Ultrahigh-speed mounting head and chip mounter
  • Ultrahigh-speed mounting head and chip mounter

Examples

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Embodiment Construction

[0022] It should be understood that the terminology and specific structural and functional details disclosed herein are representative only for describing specific embodiments, but the application can be embodied in many alternative forms and should not be construed as merely Be limited by the examples set forth herein.

[0023] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating relative importance, or implicitly indicating the quantity of indicated technical features. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of these features; "plurality" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, possible presence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0024] Al...

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PUM

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Abstract

The invention discloses an ultra-high-speed mounting head. The mounting head comprises a rack, a grabbing assembly used for grabbing or mounting components, and a horizontal turret assembly arranged on the rack. The horizontal turret assembly comprises a rotating shaft, and the grabbing assembly is arranged on the rotating shaft. According to the mounting head provided by the invention, the specific horizontal turret assembly is arranged, so that the mounting speed of the device, such as a chip mounter, etc., can be greatly improved on the premise of not increasing too much cost only by additionally arranging the grabbing assembly on the rotating shaft.

Description

technical field [0001] The application relates to the field of automation equipment, in particular to an ultra-high-speed placement head and a placement machine. Background technique [0002] The placement machine plays a very important role in the manufacturing process of circuit board packaging. It is the largest investment and the most advanced technology in the production equipment of contemporary mainstream electronic assembly technology. It has the greatest impact on the production capacity and production efficiency of the SMT (Surface Mounted Technology) production line. device of. In fact, the most faults and speed bottlenecks largely come from the placement process, so the development of placement machine equipment is the most eye-catching. [0003] In order to break through the speed bottleneck of the placement machine, it is mainly achieved by increasing the number of placement heads or increasing the number of suction nozzles on each placement head, which makes ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
CPCH05K13/041
Inventor 方强
Owner 方强
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