Preparation method of functional film layer, preparation method of optoelectronic device and optoelectronic device
A technology of photoelectric devices and photoelectric devices, applied in the field of optics, can solve problems such as uneven distribution, and achieve the effects of improving uniformity, good luminous uniformity, and high external quantum efficiency
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[0032] According to a first aspect of the present application, a method for preparing a functional film layer is provided, comprising the following steps: S1, providing a pixel substrate, the pixel substrate has a pixel defining layer, the pixel defining layer encloses a plurality of target areas, each target area is The area includes a bottom surface and a side surface; S2, provide a first solution, the first solution includes a first solvent and a solute, set the first solution in the target area, remove the first solvent, and form a hydrophobic layer on the side surface, the hydrophobic layer The surface energy is less than 30mN / m, and the hydrophobic layer covers more than 80% of the side surface; S3, provide a second solution, the second solution includes a second solvent, set the second solution in the target area, remove the second solvent, A functional film layer is formed on the surface; wherein, the surface tension of the first solution is 20-50 mN / m, the viscosity of...
Embodiment 1
[0056] Prepare a substrate with a pixel-defining layer (pixel isolation structure), the material of the pixel-defining layer is polyimide, the size of the bottom surface of the sub-pixel pits formed by the pixel-defining layer is 112 μm*112 μm, and the height of the pixel-defining layer is 2.49 μm micron, the volume of the sub-pixel pit is 31.2pL, the aforementioned substrate is cleaned in the order of acetone, deionized water, and ethanol before printing, and the O 2 Plasma cleaning for 10min; put the first solution (recipe in Table 1) into a 10pL printing nozzle, each nozzle prints 3 drops (ie 30pL) in the same sub-pixel pit of the above-mentioned substrate, then vacuum-drying and annealing at 200°C for 10 minutes , form a first hydrophobic layer on the side surface of the sub-pixel pit, the thickness of the first hydrophobic layer is about 13nm; then print the PEDOT:PSS solution (see Table 2 for the formula), and print it on the sub-pixel where the first hydrophobic layer ha...
Embodiment 2
[0058] The difference between this example and Example 1 is that after the PEDOT:PSS hole injection layer is formed, the first solution (see Table 1 for the recipe) is printed on the hole transport layer, dried in vacuum and annealed at 200°C for 10 minutes. A second hydrophobic layer is formed on the side surfaces of the sub-pixel pits, and the thickness of the second hydrophobic layer is about 26 nm; then, the TFB solution (see Table 3 for the formula) is printed into the sub-pixel pits where the second hydrophobic layer has been formed, and vacuum-dried for 10 minutes. The glove box was annealed at 150 °C for 30 min to form a TFB hole transport layer with a thickness of 25 nm.
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