Over-foaming protection device and over-foaming protection method of tank cleaning equipment
A technology for protecting devices and cleaning equipment, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc. The problem of slow liquid discharge, etc., can reduce the phenomenon of over-etching, reduce the contact time, and avoid serious losses.
Active Publication Date: 2022-07-19
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0004] However, the existing wafer protection device can only clean the low-temperature diluted chemical solution multiple times, and the high-temperature and high-concentration chemical solution cannot be discharged directly, but can only be discharged into the cooling tank, which causes the existing wafer The protective device cannot realize multiple DIW or UPW flushing; moreover, due to the hydration exothermic reaction of high-temperature and high-concentration chemical liquids, such as SPM (Sulfuric acid Peroxide Mixture, sulfuric acid peroxide mixture), its temperature will rise sharply after contacting water High, which also makes the high-concentration high-temperature chemical liquid cleaning tank unable to apply to the existing wafer protection device
In addition, due to the slow discharge rate of high-temperature and high-concentration chemical liquid, this will also aggravate the over-bubbling of the wafer
Method used
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[0043] In order for those skilled in the art to better understand the technical solutions of the present invention, the over-foaming protection device and the over-foaming protection method of the tank cleaning equipment provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
[0044] see figure 1, the over-bubble protection device of the tank-type cleaning equipment provided by the embodiment of the present invention is arranged in the tank-type cleaning equipment, and is used to protect the object to be cleaned when over-bubble occurs in the cleaning tank 1 of the tank-type cleaning equipment. The cleaning parts are protected to avoid damage to the cleaned parts due to over-etching. In this embodiment, the workpiece to be cleaned is a wafer 4, which is usually carried by a flower basket 5. During the cleaning process, the flower basket 5 is put into the cleaning tank 1 together with the wafer 4, and the ...
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Embodiments of the present invention provide an over-bubble protection device and an over-bubble protection method for tank cleaning equipment. The over-bubble protection device is provided in the tank type cleaning equipment and includes a lift mechanism and a liquid discharge mechanism, wherein the lift The mechanism can be raised and lowered in the cleaning tank of the tank-type cleaning equipment, and is used to drive the lifting and lowering of the cleaned parts; the liquid discharge mechanism is connected with the cleaning tank and is used to discharge the liquid in the cleaning tank. The technical solutions of the over-foaming protection device and the over-foaming protection method for tank cleaning equipment provided by the embodiments of the present invention have a wide application range, and are especially suitable for cleaning tanks containing high-temperature and high-concentration chemical liquids, and can significantly reduce the over-bubble protection. Over-etching caused by bubbles.
Description
technical field [0001] The present invention relates to the technical field of semiconductor processing, and in particular, to an over-bubble protection device and an over-bubble protection method for tank cleaning equipment. Background technique [0002] The tank cleaning equipment realizes the cleaning process of batch wafers by conveying batch wafers and soaking them in chemical solution tank, water tank and drying tank in turn. The main liquids used in tank cleaning equipment can be divided into two categories according to the process concentration and temperature. One is low-temperature diluted liquids, such as: HF (Hydrofluoric Acid, hydrogen fluoride acid) and BOE (Buffered OxideEtch, buffered oxide etching) liquid); one is high-temperature and high-concentration liquid, such as SPM (Sulfuric acid Peroxide Mixture, sulfuric acid hydrogen peroxide mixture, the process temperature is around 125 ℃) and H 3 PO 4 (The process temperature is around 160°C). Process liquid...
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IPC IPC(8): B08B3/04B08B3/08B08B3/10B08B13/00B08B3/02H01L21/67
CPCB08B3/045B08B3/08B08B3/10B08B13/00B08B3/02H01L21/67051
Inventor 李嘉吴仪
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD