Unlock instant, AI-driven research and patent intelligence for your innovation.

A semiconductor process equipment, isolation valve and control method

A process equipment and isolation valve technology, applied in semiconductor/solid-state device manufacturing, mechanical equipment, valve devices, etc., can solve problems such as contamination of impurity particles in the cabin, and achieve the effect of reducing the probability of equipment damage and improving the yield.

Active Publication Date: 2022-07-12
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present disclosure is at least partly to solve the technical problem that the chamber of the semiconductor process equipment in the prior art is easily polluted by foreign particles

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A semiconductor process equipment, isolation valve and control method
  • A semiconductor process equipment, isolation valve and control method
  • A semiconductor process equipment, isolation valve and control method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present disclosure.

[0033] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. The figures are not to scale, some details have been exaggerated for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the figures, as well as their relative sizes and positional relationships are only exemplary, and may vary in practice due to manufacturing tolerances or technical limitations, and those skilled in the art will Regions / layers with differen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a semiconductor process equipment, an isolation valve and a control method. The equipment comprises: a first cabin and a second cabin; an isolation valve is arranged between the first cabin and the second cabin; the isolation valve includes : a valve plate, a filter module, an air extraction module and a control module; the control module is connected with the valve plate to drive the valve plate to move back and forth, thereby connecting or separating the first compartment and the second compartment; The air extraction module is connected with the filter module to adsorb impurities to the filter module. The semiconductor process equipment, isolation valve and control method provided by the present invention are used to solve the technical problem that the chamber of the semiconductor process equipment in the prior art is easily polluted by impurity particles. The technical effect of reducing chamber, internal equipment and wafer contamination, improving yield and reducing the chance of equipment damage is achieved.

Description

technical field [0001] The present disclosure relates to the field of semiconductors, and in particular, to a semiconductor process equipment, an isolation valve and a control method. Background technique [0002] The semiconductor manufacturing process has many steps, and different process steps are often performed in different process chambers, so the wafers need to be moved between different chambers. In view of the requirements of vacuum conditions in many processes, isolation valves are often set between each chamber. [0003] However, when the isolation valve is opened, impurity particles often enter the cabin with high cleanliness requirements, causing contamination of the cabin and equipment, causing equipment failure or causing wafer defects, resulting in lower yields. [0004] For example, an isolation valve is set between the process chamber provided with the electrostatic chuck and the transfer chamber provided with the robotic arm. When the wafer needs to be ta...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F16K3/02F16K3/30F16K3/314F16K51/02H01L21/67
CPCF16K3/029F16K3/30F16K3/314F16K51/02H01L21/67011H01L21/6719
Inventor 崔珍善李俊杰李琳王佳
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI